Radiation exposure induced failure on semiconductor package material

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Semiconductor industry has progressed towards the creation of packages with sub-micron technology. Quad-Flat No-Lead (QFN) package is among latest form semiconductor package in submicron size scale. Recent trends in digitization era lead to electronic package application in many fields including radioactive environment. In the development of semiconductor technology, the ability to predict and eventually to prevent failures of microelectronics is becoming increasingly important. This paper presents an effect of 1.33 MeV gamma irradiation induced failure in semiconductor packages. The packages were exposed to gamma radiation from a Cobalt-60 source with varying doses from 5 Gy to 50 000 Gy with an operating dose rate of 2.54 kGy/h. In this investigation, as-received packages were used as control samples. Following exposure to gamma ray, the inhouse fabricated QFN package then subjected to Scanning Acoustic Microscope (CSAM) and X-ray Imaging System (3D CT scan X-ray) to check the influence of radiation exposure on the package. Detail analysis exhibited that the increment of exposure dose influenced the occurrence of the wire sweep, delamination and cracks. The delamination occurs at the silicon die and leadframe region and the cracks were observed at the die surface. The gamma irradiation is believed to induce the failure in QFN package.

Original languageEnglish
Title of host publication2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings
Pages604-607
Number of pages4
DOIs
Publication statusPublished - 2012
Event2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Kuala Lumpur
Duration: 19 Sep 201221 Sep 2012

Other

Other2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012
CityKuala Lumpur
Period19/9/1221/9/12

Fingerprint

Semiconductor materials
Radiation
Lead
Delamination
Gamma rays
Irradiation
Acoustic microscopes
Cracks
X rays
Computerized tomography
Analog to digital conversion
Microelectronics
Imaging systems
Cobalt
Wire
Scanning
Silicon
Industry

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Yusoff, W. Y. W., Jalar @ Jalil, A., Othman, N. K., Abdul Rahman, I., Shamsudin, R., & Abdul Hamid, M. A. (2012). Radiation exposure induced failure on semiconductor package material. In 2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings (pp. 604-607). [6417218] https://doi.org/10.1109/SMElec.2012.6417218

Radiation exposure induced failure on semiconductor package material. / Yusoff, Wan Yusmawati Wan; Jalar @ Jalil, Azman; Othman, Norinsan Kamil; Abdul Rahman, Irman; Shamsudin, Roslinda; Abdul Hamid, Muhammad Azmi.

2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings. 2012. p. 604-607 6417218.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yusoff, WYW, Jalar @ Jalil, A, Othman, NK, Abdul Rahman, I, Shamsudin, R & Abdul Hamid, MA 2012, Radiation exposure induced failure on semiconductor package material. in 2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings., 6417218, pp. 604-607, 2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012, Kuala Lumpur, 19/9/12. https://doi.org/10.1109/SMElec.2012.6417218
Yusoff WYW, Jalar @ Jalil A, Othman NK, Abdul Rahman I, Shamsudin R, Abdul Hamid MA. Radiation exposure induced failure on semiconductor package material. In 2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings. 2012. p. 604-607. 6417218 https://doi.org/10.1109/SMElec.2012.6417218
Yusoff, Wan Yusmawati Wan ; Jalar @ Jalil, Azman ; Othman, Norinsan Kamil ; Abdul Rahman, Irman ; Shamsudin, Roslinda ; Abdul Hamid, Muhammad Azmi. / Radiation exposure induced failure on semiconductor package material. 2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings. 2012. pp. 604-607
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