Process characterization of wet etching for high aspect ratio microneedles development

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Research on microneedles has been increasing rapidly as to overcome the drawbacks of conventional needle which can results in painful during injection, tissue damage and skin infection at the injected site. This paper presents characterization process of wet isotropic etch for solid microneedles array development. This approach utilizes HNA etchant to build the outer shape of solid microneedles. Works has been carried out to investigate the isotropic etching behavior of HNA in different temperature ranging from 20 to 50 degrees, various agitation rate ranging from 0 rpm to 450 rpm and on the various window size ranging from 100 μm to 500 μm. Characterization on those factor, determine the effect of vertical and lateral etch rate variations, surface quality and the geometry obtained. The experimental responses of vertical etch rate, lateral etch rate and high aspect ratio reported. The obtained etching properties will be applied to develop recipes to fabricate outer shape of solid microneedles' tip.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages341-344
Number of pages4
Volume74
DOIs
Publication statusPublished - 2009
EventInternational Conference on Materials for Advanced Technologies, ICMAT 2009 - Singpore
Duration: 28 Jun 20093 Jul 2009

Publication series

NameAdvanced Materials Research
Volume74
ISSN (Print)10226680

Other

OtherInternational Conference on Materials for Advanced Technologies, ICMAT 2009
CitySingpore
Period28/6/093/7/09

Fingerprint

Wet etching
Aspect ratio
Etching
Needles
Surface properties
Skin
Tissue
Geometry
Temperature

Keywords

  • HNA
  • Microneedles
  • Wet isotropic etch

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Process characterization of wet etching for high aspect ratio microneedles development. / Abd Aziz, Norazreen; Buyong, Muhamad Ramdzan; Yeop Majlis, Burhanuddin.

Advanced Materials Research. Vol. 74 2009. p. 341-344 (Advanced Materials Research; Vol. 74).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abd Aziz, N, Buyong, MR & Yeop Majlis, B 2009, Process characterization of wet etching for high aspect ratio microneedles development. in Advanced Materials Research. vol. 74, Advanced Materials Research, vol. 74, pp. 341-344, International Conference on Materials for Advanced Technologies, ICMAT 2009, Singpore, 28/6/09. https://doi.org/10.4028/www.scientific.net/AMR.74.341
@inproceedings{3488ff3443f6495992410e3ba715db8e,
title = "Process characterization of wet etching for high aspect ratio microneedles development",
abstract = "Research on microneedles has been increasing rapidly as to overcome the drawbacks of conventional needle which can results in painful during injection, tissue damage and skin infection at the injected site. This paper presents characterization process of wet isotropic etch for solid microneedles array development. This approach utilizes HNA etchant to build the outer shape of solid microneedles. Works has been carried out to investigate the isotropic etching behavior of HNA in different temperature ranging from 20 to 50 degrees, various agitation rate ranging from 0 rpm to 450 rpm and on the various window size ranging from 100 μm to 500 μm. Characterization on those factor, determine the effect of vertical and lateral etch rate variations, surface quality and the geometry obtained. The experimental responses of vertical etch rate, lateral etch rate and high aspect ratio reported. The obtained etching properties will be applied to develop recipes to fabricate outer shape of solid microneedles' tip.",
keywords = "HNA, Microneedles, Wet isotropic etch",
author = "{Abd Aziz}, Norazreen and Buyong, {Muhamad Ramdzan} and {Yeop Majlis}, Burhanuddin",
year = "2009",
doi = "10.4028/www.scientific.net/AMR.74.341",
language = "English",
isbn = "0878493212",
volume = "74",
series = "Advanced Materials Research",
pages = "341--344",
booktitle = "Advanced Materials Research",

}

TY - GEN

T1 - Process characterization of wet etching for high aspect ratio microneedles development

AU - Abd Aziz, Norazreen

AU - Buyong, Muhamad Ramdzan

AU - Yeop Majlis, Burhanuddin

PY - 2009

Y1 - 2009

N2 - Research on microneedles has been increasing rapidly as to overcome the drawbacks of conventional needle which can results in painful during injection, tissue damage and skin infection at the injected site. This paper presents characterization process of wet isotropic etch for solid microneedles array development. This approach utilizes HNA etchant to build the outer shape of solid microneedles. Works has been carried out to investigate the isotropic etching behavior of HNA in different temperature ranging from 20 to 50 degrees, various agitation rate ranging from 0 rpm to 450 rpm and on the various window size ranging from 100 μm to 500 μm. Characterization on those factor, determine the effect of vertical and lateral etch rate variations, surface quality and the geometry obtained. The experimental responses of vertical etch rate, lateral etch rate and high aspect ratio reported. The obtained etching properties will be applied to develop recipes to fabricate outer shape of solid microneedles' tip.

AB - Research on microneedles has been increasing rapidly as to overcome the drawbacks of conventional needle which can results in painful during injection, tissue damage and skin infection at the injected site. This paper presents characterization process of wet isotropic etch for solid microneedles array development. This approach utilizes HNA etchant to build the outer shape of solid microneedles. Works has been carried out to investigate the isotropic etching behavior of HNA in different temperature ranging from 20 to 50 degrees, various agitation rate ranging from 0 rpm to 450 rpm and on the various window size ranging from 100 μm to 500 μm. Characterization on those factor, determine the effect of vertical and lateral etch rate variations, surface quality and the geometry obtained. The experimental responses of vertical etch rate, lateral etch rate and high aspect ratio reported. The obtained etching properties will be applied to develop recipes to fabricate outer shape of solid microneedles' tip.

KW - HNA

KW - Microneedles

KW - Wet isotropic etch

UR - http://www.scopus.com/inward/record.url?scp=73549104835&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=73549104835&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/AMR.74.341

DO - 10.4028/www.scientific.net/AMR.74.341

M3 - Conference contribution

SN - 0878493212

SN - 9780878493210

VL - 74

T3 - Advanced Materials Research

SP - 341

EP - 344

BT - Advanced Materials Research

ER -