Patent landscape and market segments of sintered silver as die attach materials in microelectronic packaging

Kim Shyong Siow, Merigeault Eugenie

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Sintered silver (Ag) is a porous silver attaching the semiconductor die to the microelectronic substrates. The market sizes for sintered Ag are explored, and the relevant patents are analyzed at macro and micro-levels. At the macro-level, patenting activity moves to Stage 2 of the technology life-cycle 's-curve'. In stage 2, patenting slows down before the next surge in patenting, likely to be spurred by the wider adoption of wide band-gap semiconductor. The low profitability of sintered Ag also coincides with the available market research reports on the three major market of this technology, i.e., power module, power discrete technology and consumer integrated circuits. However, the patent owners are not abandoning their patents applications. Only eleven entities are co-filing patents related to sintered Ag based on 350 patents and patent applications analyzed here. Such trend suggests the nascent characteristics and continuing investment in this technology. At the micro-level, patenting addresses the following issues. Firstly, pressure assisted sintering is necessary and more reliable than pressureless sintering but the former requires additional process controls and capital investments than the latter. The current state of the art of sintered Ag joint also favours sintering in an ambient environment that oxidizes the substrate. This oxidation poses a delamination risk, and a reliability concern to the microelectronic packages. Lastly, sintered Ag paste favours sintering on the Ag or Au-metallized substrate that represents an additional cost to the customers.

Original languageEnglish
Title of host publication2016 IEEE 37th International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Volume2016-November
ISBN (Electronic)9781509034437
DOIs
Publication statusPublished - 28 Nov 2016
Event37th IEEE International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016 - Georgetown, Penang, Malaysia
Duration: 20 Sep 201622 Sep 2016

Other

Other37th IEEE International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016
CountryMalaysia
CityGeorgetown, Penang
Period20/9/1622/9/16

Fingerprint

Microelectronics
Packaging
Silver
Sintering
Macros
Substrates
Delamination
Process control
Integrated circuits
Life cycle
Profitability
Semiconductor materials
Oxidation
Costs

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

Siow, K. S., & Eugenie, M. (2016). Patent landscape and market segments of sintered silver as die attach materials in microelectronic packaging. In 2016 IEEE 37th International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016 (Vol. 2016-November). [7761974] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEMT.2016.7761974

Patent landscape and market segments of sintered silver as die attach materials in microelectronic packaging. / Siow, Kim Shyong; Eugenie, Merigeault.

2016 IEEE 37th International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016. Vol. 2016-November Institute of Electrical and Electronics Engineers Inc., 2016. 7761974.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Siow, KS & Eugenie, M 2016, Patent landscape and market segments of sintered silver as die attach materials in microelectronic packaging. in 2016 IEEE 37th International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016. vol. 2016-November, 7761974, Institute of Electrical and Electronics Engineers Inc., 37th IEEE International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016, Georgetown, Penang, Malaysia, 20/9/16. https://doi.org/10.1109/IEMT.2016.7761974
Siow KS, Eugenie M. Patent landscape and market segments of sintered silver as die attach materials in microelectronic packaging. In 2016 IEEE 37th International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016. Vol. 2016-November. Institute of Electrical and Electronics Engineers Inc. 2016. 7761974 https://doi.org/10.1109/IEMT.2016.7761974
Siow, Kim Shyong ; Eugenie, Merigeault. / Patent landscape and market segments of sintered silver as die attach materials in microelectronic packaging. 2016 IEEE 37th International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016. Vol. 2016-November Institute of Electrical and Electronics Engineers Inc., 2016.
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