Optimization of nickel thickness on substrate for TBGA using SAC387 solder material

Ibrahim Ahmad, Burhanuddin Yeop Majlis, Azman Jalar @ Jalil, Eu Poh Leng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The purpose of this paper is to discuss the effect of Nickel (Ni) thickness on lead free solder joint material for tape ball grid array (TBGA) application. In this study, four different level of Nickel thickness were chose that is 3um, 4um, 5um and 6 um. Ball pull testing was used to assess the solder joint performance at time zero, after multiple reflow and high temperature storage (HTS). The machine that was used for the ball pull test is Dage 4000 series. A design of experiment (DOE) based approach is used to study and understand ball pull strength data based on effect of Ni thickness. Statistical results performed shows that 4um is the most preferred thickness for the Ni layer, thus giving a significant effect, supported by thinner Intermetallic layer thickness and area.

Original languageEnglish
Title of host publicationProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
Pages192-194
Number of pages3
DOIs
Publication statusPublished - 2007
Event32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT - San Jose, CA
Duration: 3 Oct 20075 Oct 2007

Other

Other32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT
CitySan Jose, CA
Period3/10/075/10/07

Fingerprint

Ball grid arrays
Soldering alloys
Tapes
Nickel
Substrates
Design of experiments
Intermetallics
Testing
Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Ahmad, I., Yeop Majlis, B., Jalar @ Jalil, A., & Leng, E. P. (2007). Optimization of nickel thickness on substrate for TBGA using SAC387 solder material. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium (pp. 192-194). [4417067] https://doi.org/10.1109/IEMT.2007.4417067

Optimization of nickel thickness on substrate for TBGA using SAC387 solder material. / Ahmad, Ibrahim; Yeop Majlis, Burhanuddin; Jalar @ Jalil, Azman; Leng, Eu Poh.

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2007. p. 192-194 4417067.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ahmad, I, Yeop Majlis, B, Jalar @ Jalil, A & Leng, EP 2007, Optimization of nickel thickness on substrate for TBGA using SAC387 solder material. in Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium., 4417067, pp. 192-194, 32nd IEEE International Electronics Manufacturing Technology Symposium, IEMT, San Jose, CA, 3/10/07. https://doi.org/10.1109/IEMT.2007.4417067
Ahmad I, Yeop Majlis B, Jalar @ Jalil A, Leng EP. Optimization of nickel thickness on substrate for TBGA using SAC387 solder material. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2007. p. 192-194. 4417067 https://doi.org/10.1109/IEMT.2007.4417067
Ahmad, Ibrahim ; Yeop Majlis, Burhanuddin ; Jalar @ Jalil, Azman ; Leng, Eu Poh. / Optimization of nickel thickness on substrate for TBGA using SAC387 solder material. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2007. pp. 192-194
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