Optimization of KOH etching process for MEMS square diaphragm using response surface method

Norliana Yusof, Badariah Bais, Norhayati Soin, Jumril Yunas, Burhanuddin Yeop Majlis

Research output: Contribution to journalArticle

Abstract

Potassium hydroxide (KOH) wet etching is widely used in realizing microelectromechanical systems (MEMS) diaphragm due to its low cost, safe and easy handling. However, a variety of etching parameters such as etchant concentration, temperature, mask size and etching time need to be optimized thoroughly in order to save the time and costs of the etching process. This paper presents the numerical study and optimization of KOH etching process parameters using the response surface method (RSM) to realize the desired shape and size of MEMS diaphragm. Face central composite design (FCC) of RSM was employed as the experimental design to analyze the result and generate a mathematical prediction model. From the analysis, the temperature was identified as the most significant process parameter that affects the etching rate, thus affecting the thickness and size of the diaphragm. The results of RSM prediction for optimization were applied in this study. Particularly, 45% of KOH concentration, temperature of 80°C, 1735 µm2 of mask size, and 7.2 hours of etching time were implemented to obtain a square MEMS diaphragm with thickness of 120 µm and size of 1200 µm2. The results of RSM based optimization method for KOH wet etching offers a quick and effective method for realizing a desired MEMS devices.

Original languageEnglish
Pages (from-to)113-121
Number of pages9
JournalIndonesian Journal of Electrical Engineering and Computer Science
Volume15
Issue number1
DOIs
Publication statusPublished - 1 Jul 2019

Fingerprint

Response Surface Method
Etching
Diaphragms
Micro-electro-mechanical Systems
MEMS
Optimization
Wet etching
Masks
Process Parameters
Mask
Potassium hydroxide
Design of experiments
Temperature
Costs
Numerical Optimization
Potassium
Experimental design
Prediction Model
Optimization Methods
Numerical Study

Keywords

  • Etching process optimization
  • KOH etching
  • MEMS square diaphragm
  • Response surface method
  • Wet etching

ASJC Scopus subject areas

  • Signal Processing
  • Information Systems
  • Hardware and Architecture
  • Computer Networks and Communications
  • Control and Optimization
  • Electrical and Electronic Engineering

Cite this

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title = "Optimization of KOH etching process for MEMS square diaphragm using response surface method",
abstract = "Potassium hydroxide (KOH) wet etching is widely used in realizing microelectromechanical systems (MEMS) diaphragm due to its low cost, safe and easy handling. However, a variety of etching parameters such as etchant concentration, temperature, mask size and etching time need to be optimized thoroughly in order to save the time and costs of the etching process. This paper presents the numerical study and optimization of KOH etching process parameters using the response surface method (RSM) to realize the desired shape and size of MEMS diaphragm. Face central composite design (FCC) of RSM was employed as the experimental design to analyze the result and generate a mathematical prediction model. From the analysis, the temperature was identified as the most significant process parameter that affects the etching rate, thus affecting the thickness and size of the diaphragm. The results of RSM prediction for optimization were applied in this study. Particularly, 45{\%} of KOH concentration, temperature of 80°C, 1735 µm2 of mask size, and 7.2 hours of etching time were implemented to obtain a square MEMS diaphragm with thickness of 120 µm and size of 1200 µm2. The results of RSM based optimization method for KOH wet etching offers a quick and effective method for realizing a desired MEMS devices.",
keywords = "Etching process optimization, KOH etching, MEMS square diaphragm, Response surface method, Wet etching",
author = "Norliana Yusof and Badariah Bais and Norhayati Soin and Jumril Yunas and {Yeop Majlis}, Burhanuddin",
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AU - Yusof, Norliana

AU - Bais, Badariah

AU - Soin, Norhayati

AU - Yunas, Jumril

AU - Yeop Majlis, Burhanuddin

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AB - Potassium hydroxide (KOH) wet etching is widely used in realizing microelectromechanical systems (MEMS) diaphragm due to its low cost, safe and easy handling. However, a variety of etching parameters such as etchant concentration, temperature, mask size and etching time need to be optimized thoroughly in order to save the time and costs of the etching process. This paper presents the numerical study and optimization of KOH etching process parameters using the response surface method (RSM) to realize the desired shape and size of MEMS diaphragm. Face central composite design (FCC) of RSM was employed as the experimental design to analyze the result and generate a mathematical prediction model. From the analysis, the temperature was identified as the most significant process parameter that affects the etching rate, thus affecting the thickness and size of the diaphragm. The results of RSM prediction for optimization were applied in this study. Particularly, 45% of KOH concentration, temperature of 80°C, 1735 µm2 of mask size, and 7.2 hours of etching time were implemented to obtain a square MEMS diaphragm with thickness of 120 µm and size of 1200 µm2. The results of RSM based optimization method for KOH wet etching offers a quick and effective method for realizing a desired MEMS devices.

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