Optical interconnect chip with SPR-based photonic crystal waveguide sensor

Kalaivani A. Tarumaraja, P. Susthitha Menon N V Visvanathan, Fairus Atida Said, Nur Akmar Jamil, Gan Siew Mei Sahbudin Shaari, Burhanuddin Yeop Majlis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this study, we designed a novel optical interconnect chip (OIC) consisting of a Fabry-Perot laser as the light source, surface plasmon resonance (SPR)-based photonic crystal waveguide as a biosensor, and a photodetector (PD). The laser output and responsivity of the photodetector were investigated based on refractive index (RI) of 1.333 and 1.335, corresponding to different urea molarities. The method used to investigate the OIC design is by simulation using INTERCONNECT solver from Lumerical. The laser emits at 800 nm wavelength. The lasing threshold current is 0.015A at output power of 0.0021W whereas the PD has marked responsivity of 1.0 A/W. Increment in the RI value from 1.333 to 1.335 increases the OIC responsivity from 0.4 A/W to 0.8 A/W at a given optical power of 0.025 μW. This OIC design is suitable for biosensor chip in medical applications to detect diseases due to changes in RI.

Original languageEnglish
Title of host publicationTENCON 2017 - 2017 IEEE Region 10 Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2698-2701
Number of pages4
Volume2017-December
ISBN (Electronic)9781509011339
DOIs
Publication statusPublished - 19 Dec 2017
Event2017 IEEE Region 10 Conference, TENCON 2017 - Penang, Malaysia
Duration: 5 Nov 20178 Nov 2017

Other

Other2017 IEEE Region 10 Conference, TENCON 2017
CountryMalaysia
CityPenang
Period5/11/178/11/17

Fingerprint

Optical interconnects
Surface plasmon resonance
Photonic crystals
Waveguides
Photodetectors
Refractive index
Sensors
Biosensors
Lasers
Medical applications
Urea
Light sources
Wavelength

Keywords

  • Fabry-Perot Laser
  • INTERCONNECT
  • Optical Interconnect Chip
  • Photodetector

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

Tarumaraja, K. A., N V Visvanathan, P. S. M., Said, F. A., Jamil, N. A., Shaari, G. S. M. S., & Yeop Majlis, B. (2017). Optical interconnect chip with SPR-based photonic crystal waveguide sensor. In TENCON 2017 - 2017 IEEE Region 10 Conference (Vol. 2017-December, pp. 2698-2701). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TENCON.2017.8228319

Optical interconnect chip with SPR-based photonic crystal waveguide sensor. / Tarumaraja, Kalaivani A.; N V Visvanathan, P. Susthitha Menon; Said, Fairus Atida; Jamil, Nur Akmar; Shaari, Gan Siew Mei Sahbudin; Yeop Majlis, Burhanuddin.

TENCON 2017 - 2017 IEEE Region 10 Conference. Vol. 2017-December Institute of Electrical and Electronics Engineers Inc., 2017. p. 2698-2701.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tarumaraja, KA, N V Visvanathan, PSM, Said, FA, Jamil, NA, Shaari, GSMS & Yeop Majlis, B 2017, Optical interconnect chip with SPR-based photonic crystal waveguide sensor. in TENCON 2017 - 2017 IEEE Region 10 Conference. vol. 2017-December, Institute of Electrical and Electronics Engineers Inc., pp. 2698-2701, 2017 IEEE Region 10 Conference, TENCON 2017, Penang, Malaysia, 5/11/17. https://doi.org/10.1109/TENCON.2017.8228319
Tarumaraja KA, N V Visvanathan PSM, Said FA, Jamil NA, Shaari GSMS, Yeop Majlis B. Optical interconnect chip with SPR-based photonic crystal waveguide sensor. In TENCON 2017 - 2017 IEEE Region 10 Conference. Vol. 2017-December. Institute of Electrical and Electronics Engineers Inc. 2017. p. 2698-2701 https://doi.org/10.1109/TENCON.2017.8228319
Tarumaraja, Kalaivani A. ; N V Visvanathan, P. Susthitha Menon ; Said, Fairus Atida ; Jamil, Nur Akmar ; Shaari, Gan Siew Mei Sahbudin ; Yeop Majlis, Burhanuddin. / Optical interconnect chip with SPR-based photonic crystal waveguide sensor. TENCON 2017 - 2017 IEEE Region 10 Conference. Vol. 2017-December Institute of Electrical and Electronics Engineers Inc., 2017. pp. 2698-2701
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