On the shear strength and mixed-mode fracture toughness of a lead-tin and a tin-silver solder

M. Manoharan, Kim Shyong Siow, M. W. Weiser

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The increasing demands on solder joints have made it imperative that they perform not only their traditional role of electrical connection but also possess good mechanical integrity. One such key mechanical property is the shear strength of the solder. A number of specimen geometries can be used to evaluate the shear strength of solders, each with its advantages and limitations. This study uses a modified double lap shear geometry to measure the shear strength of the solders as a function of strain rate. It is shown that the shear strength measured this way is truly reflective of the complex composite formed by the copper, solder and intermetallics and may be more representative of actual conditions of use rather than measurements of the shear strengths of the bulk solder. The study also uses a modified compact tension specimen to measure the fracture of the solder under combined tensile-shear loading conditions. It is shown that the solder fracture under these conditions follows the general principles of a mixed-mode fracture mechanism map.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium - Proceedings
PublisherMRS
Pages111-116
Number of pages6
Volume515
Publication statusPublished - 1998
Externally publishedYes
EventProceedings of the 1998 MRS Spring Symposium - San Francisco, CA, USA
Duration: 14 Apr 199816 Apr 1998

Other

OtherProceedings of the 1998 MRS Spring Symposium
CitySan Francisco, CA, USA
Period14/4/9816/4/98

Fingerprint

Tin
Silver
Shear strength
Soldering alloys
Fracture toughness
Lead
Geometry
Intermetallics
Strain rate
Copper
Mechanical properties
Composite materials

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Manoharan, M., Siow, K. S., & Weiser, M. W. (1998). On the shear strength and mixed-mode fracture toughness of a lead-tin and a tin-silver solder. In Materials Research Society Symposium - Proceedings (Vol. 515, pp. 111-116). MRS.

On the shear strength and mixed-mode fracture toughness of a lead-tin and a tin-silver solder. / Manoharan, M.; Siow, Kim Shyong; Weiser, M. W.

Materials Research Society Symposium - Proceedings. Vol. 515 MRS, 1998. p. 111-116.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Manoharan, M, Siow, KS & Weiser, MW 1998, On the shear strength and mixed-mode fracture toughness of a lead-tin and a tin-silver solder. in Materials Research Society Symposium - Proceedings. vol. 515, MRS, pp. 111-116, Proceedings of the 1998 MRS Spring Symposium, San Francisco, CA, USA, 14/4/98.
Manoharan M, Siow KS, Weiser MW. On the shear strength and mixed-mode fracture toughness of a lead-tin and a tin-silver solder. In Materials Research Society Symposium - Proceedings. Vol. 515. MRS. 1998. p. 111-116
Manoharan, M. ; Siow, Kim Shyong ; Weiser, M. W. / On the shear strength and mixed-mode fracture toughness of a lead-tin and a tin-silver solder. Materials Research Society Symposium - Proceedings. Vol. 515 MRS, 1998. pp. 111-116
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