Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software

M. Mazlan, A. Rahim, M. A. Iqbal, A. M. Mustafa Al Bakri, W. Razak, H. M. Nor Hakim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a printed circuit board, is carried out using a commercial CFD code, FLUENT™. The simulation is performed for 12 PLCC under different inlet velocities and chip powers. The contours of average junction temperatures are obtained for each package under different conditions. It is observed that the junction temperature of the packages decreases with increase in inlet velocity and increases with chip power. Moreover, the increase in package density significantly contributed to rise in temperature of chips. Thus the present simulation demonstrates that the chip density (the number of packages mounted on a given area), chip power and the coolant inlet velocity are strongly interconnected; hence their appropriate choice would be crucial.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages603-610
Number of pages8
Volume795
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2nd International Conference on Sustainable Materials, ICoSM 2013 - Penang
Duration: 26 Mar 201327 Mar 2013

Publication series

NameAdvanced Materials Research
Volume795
ISSN (Print)10226680

Other

Other2nd International Conference on Sustainable Materials, ICoSM 2013
CityPenang
Period26/3/1327/3/13

Fingerprint

Computational fluid dynamics
Plastics
Heat transfer
Microelectronics
Printed circuit boards
Coolants
Temperature
Numerical analysis
Flow of fluids
Thermal management (electronics)

Keywords

  • Microprocessors
  • Plastic Leaded Chip Carrier
  • Thermal Management

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Mazlan, M., Rahim, A., Iqbal, M. A., Mustafa Al Bakri, A. M., Razak, W., & Nor Hakim, H. M. (2013). Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software. In Advanced Materials Research (Vol. 795, pp. 603-610). (Advanced Materials Research; Vol. 795). https://doi.org/10.4028/www.scientific.net/AMR.795.603

Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software. / Mazlan, M.; Rahim, A.; Iqbal, M. A.; Mustafa Al Bakri, A. M.; Razak, W.; Nor Hakim, H. M.

Advanced Materials Research. Vol. 795 2013. p. 603-610 (Advanced Materials Research; Vol. 795).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mazlan, M, Rahim, A, Iqbal, MA, Mustafa Al Bakri, AM, Razak, W & Nor Hakim, HM 2013, Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software. in Advanced Materials Research. vol. 795, Advanced Materials Research, vol. 795, pp. 603-610, 2nd International Conference on Sustainable Materials, ICoSM 2013, Penang, 26/3/13. https://doi.org/10.4028/www.scientific.net/AMR.795.603
Mazlan M, Rahim A, Iqbal MA, Mustafa Al Bakri AM, Razak W, Nor Hakim HM. Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software. In Advanced Materials Research. Vol. 795. 2013. p. 603-610. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.795.603
Mazlan, M. ; Rahim, A. ; Iqbal, M. A. ; Mustafa Al Bakri, A. M. ; Razak, W. ; Nor Hakim, H. M. / Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software. Advanced Materials Research. Vol. 795 2013. pp. 603-610 (Advanced Materials Research).
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