Novel design and fabrication of high sensitivity MEMS capacitive sensor array for fingerprint imaging

Mitra Damghanian, Burhanuddin Yeop Majlis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

A novel MEMS capacitive pressure sensor array is designed and fabricated for fingerprint acquisition application. Based on analytical investigations and FEM analysis, the designed structure of pressure sensor cells assist from an aluminum clamped-clamped wide beam as the movable electrode of variant capacitor, instead of usual membrane structure. A rectangular base T-shape protrusion is also used on top of the deflecting electrode to concentrate pressure and increase the sensitivity. Proven by the real test of the fabricated sensor structure, this design has enhanced sensitivity and linearity of the device compared to all membrane based reported prototypes without crossing the dpi limits. Structural modifications have resulted in a simpler fabrication process as well.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages239-242
Number of pages4
Volume74
DOIs
Publication statusPublished - 2009
EventInternational Conference on Materials for Advanced Technologies, ICMAT 2009 - Singpore
Duration: 28 Jun 20093 Jul 2009

Publication series

NameAdvanced Materials Research
Volume74
ISSN (Print)10226680

Other

OtherInternational Conference on Materials for Advanced Technologies, ICMAT 2009
CitySingpore
Period28/6/093/7/09

Fingerprint

Capacitive sensors
Sensor arrays
Pressure sensors
MEMS
Imaging techniques
Fabrication
Membrane structures
Electrodes
Capacitors
Membranes
Aluminum
Finite element method
Sensors

Keywords

  • Fingerprint imaging
  • MEMS capacitive sensors
  • Sensor array
  • Sensor's sensitivity

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Damghanian, M., & Yeop Majlis, B. (2009). Novel design and fabrication of high sensitivity MEMS capacitive sensor array for fingerprint imaging. In Advanced Materials Research (Vol. 74, pp. 239-242). (Advanced Materials Research; Vol. 74). https://doi.org/10.4028/www.scientific.net/AMR.74.239

Novel design and fabrication of high sensitivity MEMS capacitive sensor array for fingerprint imaging. / Damghanian, Mitra; Yeop Majlis, Burhanuddin.

Advanced Materials Research. Vol. 74 2009. p. 239-242 (Advanced Materials Research; Vol. 74).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Damghanian, M & Yeop Majlis, B 2009, Novel design and fabrication of high sensitivity MEMS capacitive sensor array for fingerprint imaging. in Advanced Materials Research. vol. 74, Advanced Materials Research, vol. 74, pp. 239-242, International Conference on Materials for Advanced Technologies, ICMAT 2009, Singpore, 28/6/09. https://doi.org/10.4028/www.scientific.net/AMR.74.239
Damghanian, Mitra ; Yeop Majlis, Burhanuddin. / Novel design and fabrication of high sensitivity MEMS capacitive sensor array for fingerprint imaging. Advanced Materials Research. Vol. 74 2009. pp. 239-242 (Advanced Materials Research).
@inproceedings{29664f1b2c8e4fc485da6e4b2959d7fe,
title = "Novel design and fabrication of high sensitivity MEMS capacitive sensor array for fingerprint imaging",
abstract = "A novel MEMS capacitive pressure sensor array is designed and fabricated for fingerprint acquisition application. Based on analytical investigations and FEM analysis, the designed structure of pressure sensor cells assist from an aluminum clamped-clamped wide beam as the movable electrode of variant capacitor, instead of usual membrane structure. A rectangular base T-shape protrusion is also used on top of the deflecting electrode to concentrate pressure and increase the sensitivity. Proven by the real test of the fabricated sensor structure, this design has enhanced sensitivity and linearity of the device compared to all membrane based reported prototypes without crossing the dpi limits. Structural modifications have resulted in a simpler fabrication process as well.",
keywords = "Fingerprint imaging, MEMS capacitive sensors, Sensor array, Sensor's sensitivity",
author = "Mitra Damghanian and {Yeop Majlis}, Burhanuddin",
year = "2009",
doi = "10.4028/www.scientific.net/AMR.74.239",
language = "English",
isbn = "0878493212",
volume = "74",
series = "Advanced Materials Research",
pages = "239--242",
booktitle = "Advanced Materials Research",

}

TY - GEN

T1 - Novel design and fabrication of high sensitivity MEMS capacitive sensor array for fingerprint imaging

AU - Damghanian, Mitra

AU - Yeop Majlis, Burhanuddin

PY - 2009

Y1 - 2009

N2 - A novel MEMS capacitive pressure sensor array is designed and fabricated for fingerprint acquisition application. Based on analytical investigations and FEM analysis, the designed structure of pressure sensor cells assist from an aluminum clamped-clamped wide beam as the movable electrode of variant capacitor, instead of usual membrane structure. A rectangular base T-shape protrusion is also used on top of the deflecting electrode to concentrate pressure and increase the sensitivity. Proven by the real test of the fabricated sensor structure, this design has enhanced sensitivity and linearity of the device compared to all membrane based reported prototypes without crossing the dpi limits. Structural modifications have resulted in a simpler fabrication process as well.

AB - A novel MEMS capacitive pressure sensor array is designed and fabricated for fingerprint acquisition application. Based on analytical investigations and FEM analysis, the designed structure of pressure sensor cells assist from an aluminum clamped-clamped wide beam as the movable electrode of variant capacitor, instead of usual membrane structure. A rectangular base T-shape protrusion is also used on top of the deflecting electrode to concentrate pressure and increase the sensitivity. Proven by the real test of the fabricated sensor structure, this design has enhanced sensitivity and linearity of the device compared to all membrane based reported prototypes without crossing the dpi limits. Structural modifications have resulted in a simpler fabrication process as well.

KW - Fingerprint imaging

KW - MEMS capacitive sensors

KW - Sensor array

KW - Sensor's sensitivity

UR - http://www.scopus.com/inward/record.url?scp=73549106602&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=73549106602&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/AMR.74.239

DO - 10.4028/www.scientific.net/AMR.74.239

M3 - Conference contribution

SN - 0878493212

SN - 9780878493210

VL - 74

T3 - Advanced Materials Research

SP - 239

EP - 242

BT - Advanced Materials Research

ER -