Nanoindentation test for the strength distribution analysis of bonded Au ball bonds

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

The micromechanical properties at bonded Au ball bonds that have undergone three different time intervals of high temperature storage (HTS) have been characterised by using nanoindentation test. 12 indentations have been made at three different locations (Au, IMC and Si area) across the bonded ball bonds to evaluate the variation of hardness with the location of indentation. It was observed that each of the elements and compound that located at the bonded ball bonds exhibit different responses and micromechanical properties upon the nanoindentation tests. Au showed the highest creep behaviour compared to that of IMC and Si. It was observed that the plastic deformation response for Au and IMC were represented in load versus depth profile through the multiple pop-in events that exhibited in loading-unloading curve of Au and IMC. Finally, it was found that the hardness value and the tendency to brittle fracture of IMC were increased with the increment of the HTS time interval.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages1163-1166
Number of pages4
Volume148-149
DOIs
Publication statusPublished - 2011
Event2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010 - Shenzhen
Duration: 6 Nov 20108 Nov 2010

Publication series

NameAdvanced Materials Research
Volume148-149
ISSN (Print)10226680

Other

Other2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010
CityShenzhen
Period6/11/108/11/10

Fingerprint

Nanoindentation
Indentation
Hardness
Brittle fracture
Unloading
Plastic deformation
Creep
Temperature

Keywords

  • Bond strength
  • High temperature storage
  • Nanoindentation
  • Reliability
  • Wire bonding

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Jalar @ Jalil, A., Zulkifli, M. N., & Abdullah, S. (2011). Nanoindentation test for the strength distribution analysis of bonded Au ball bonds. In Advanced Materials Research (Vol. 148-149, pp. 1163-1166). (Advanced Materials Research; Vol. 148-149). https://doi.org/10.4028/www.scientific.net/AMR.148-149.1163

Nanoindentation test for the strength distribution analysis of bonded Au ball bonds. / Jalar @ Jalil, Azman; Zulkifli, M. N.; Abdullah, Shahrum.

Advanced Materials Research. Vol. 148-149 2011. p. 1163-1166 (Advanced Materials Research; Vol. 148-149).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jalar @ Jalil, A, Zulkifli, MN & Abdullah, S 2011, Nanoindentation test for the strength distribution analysis of bonded Au ball bonds. in Advanced Materials Research. vol. 148-149, Advanced Materials Research, vol. 148-149, pp. 1163-1166, 2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010, Shenzhen, 6/11/10. https://doi.org/10.4028/www.scientific.net/AMR.148-149.1163
Jalar @ Jalil A, Zulkifli MN, Abdullah S. Nanoindentation test for the strength distribution analysis of bonded Au ball bonds. In Advanced Materials Research. Vol. 148-149. 2011. p. 1163-1166. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.148-149.1163
Jalar @ Jalil, Azman ; Zulkifli, M. N. ; Abdullah, Shahrum. / Nanoindentation test for the strength distribution analysis of bonded Au ball bonds. Advanced Materials Research. Vol. 148-149 2011. pp. 1163-1166 (Advanced Materials Research).
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