Nanoindentation test for the stiffness distribution analysis of bonded Au ball bonds

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The Reduced Modulus value for the bonded Au ball bond that have undergone three different time intervals of high temperature storage (HTS) have been obtained by using nanoindentation test. Twelve indentations have been made at three different locations (Au, IMC and Si area) across the bonded ball bonds to evaluate the variation of Reduced Modulus with the location of indentation. It was shown that the Reduced Modulus value for the indentations at IMC area is increased with the increment of HTS time interval. It was also observed that the Reduced Modulus at the Au area was increased with the increment of the HTS exposure time. No particular pattern was noted to describe the changes of Reduced Modulus with the location of the indentations that have been made. It was also found that the average Reduced Modulus for Au obtained through nanoindentation with value of 107 GPa has higher value compared to that of the Young's modulus value obtained through actual tensile test with value of 79 GPa.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages674-677
Number of pages4
Volume154-155
DOIs
Publication statusPublished - 2011
Event2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010 - Shenzhen
Duration: 6 Nov 20108 Nov 2010

Publication series

NameAdvanced Materials Research
Volume154-155
ISSN (Print)10226680

Other

Other2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010
CityShenzhen
Period6/11/108/11/10

Fingerprint

Nanoindentation
Indentation
Stiffness
Temperature
Elastic moduli

Keywords

  • High temperature storage
  • Nanoindentation
  • Reliability
  • Stiffness
  • Wire bonding

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Othman, N. K., Zulkifli, M. N., Jalar @ Jalil, A., & Abdullah, S. (2011). Nanoindentation test for the stiffness distribution analysis of bonded Au ball bonds. In Advanced Materials Research (Vol. 154-155, pp. 674-677). (Advanced Materials Research; Vol. 154-155). https://doi.org/10.4028/www.scientific.net/AMR.154-155.674

Nanoindentation test for the stiffness distribution analysis of bonded Au ball bonds. / Othman, Norinsan Kamil; Zulkifli, M. N.; Jalar @ Jalil, Azman; Abdullah, Shahrum.

Advanced Materials Research. Vol. 154-155 2011. p. 674-677 (Advanced Materials Research; Vol. 154-155).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Othman, NK, Zulkifli, MN, Jalar @ Jalil, A & Abdullah, S 2011, Nanoindentation test for the stiffness distribution analysis of bonded Au ball bonds. in Advanced Materials Research. vol. 154-155, Advanced Materials Research, vol. 154-155, pp. 674-677, 2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010, Shenzhen, 6/11/10. https://doi.org/10.4028/www.scientific.net/AMR.154-155.674
Othman, Norinsan Kamil ; Zulkifli, M. N. ; Jalar @ Jalil, Azman ; Abdullah, Shahrum. / Nanoindentation test for the stiffness distribution analysis of bonded Au ball bonds. Advanced Materials Research. Vol. 154-155 2011. pp. 674-677 (Advanced Materials Research).
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