Nanoindentation stereometry of wire bonding

Research output: Contribution to journalArticle

Abstract

Nanoindentation approach has been considered to characterize mechanical properties of semiconductor gold wire bonding. Nanoindentation tests were conducted on the gold (Au) ball bond. The stereometry technique was used to analyze the effect of volume changes especially the substrate effect towards nanoindentation test using Infinite Focus Microscope (IFM). The indentations that located at the periphery or near crack area (indentations 1 and 4) were less affected with the substrate effect as oppose to the indentations that located at the centre area (indentations 2 and 3). Furthermore, the decrement of the applied load from 20 mN to 10 mN has decreased the substrate effect especially for the indentations at the center area as indicated though the higher width of deviation.

Original languageEnglish
Pages (from-to)474-477
Number of pages4
JournalAdvanced Science Letters
Volume13
DOIs
Publication statusPublished - Jun 2012

Fingerprint

Nanoindentation
indentation
Indentation
Gold
Wire
Semiconductors
gold
Substrate
substrate
Substrates
volume change
Microscope
Mechanical Properties
mechanical property
Crack
crack
Ball
Microscopes
Deviation
Semiconductor materials

Keywords

  • Nanoindetation
  • Stereometry
  • Wire bonding

ASJC Scopus subject areas

  • Education
  • Health(social science)
  • Mathematics(all)
  • Energy(all)
  • Computer Science(all)
  • Environmental Science(all)
  • Engineering(all)

Cite this

Nanoindentation stereometry of wire bonding. / Zulkifli, Muhammad Nubli; Jalar @ Jalil, Azman; Abdullah, Shahrum; Othman, Norinsan Kamil.

In: Advanced Science Letters, Vol. 13, 06.2012, p. 474-477.

Research output: Contribution to journalArticle

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