Nanoindentation of sn3.0Ag0.5Cu/ENIG solder joint after high temperature storage

Maria Abu Bakar, Azman Jalar @ Jalil, Roslina Ismail, Abdul Razak Daud

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This study used nanoindentation technique in order to examine the micromechanical properties of Sn3.0Ag0.5Cu (SAC305) on Electroless Nickel Immersion Gold (ENIG) surface finished Cu substrate subjected to high temperature storage. Lead free solder paste of SAC305 were soldered on ENIG substrate by reflow soldering at 215 °C for 8 second. The soldered samples were exposed to high temperature storage at 180 °C for 0, 200, 400, 600, 800 and 1000 hours. Micromechanical properties show that the solder hardness is decreasing with the HTS time from 239.13 MPa for 0 hour to 178.96 MPa for 1000 hours while the reduce modulus results has increased from 62. 16 x 103 MPa for 0 hour to 82.13 x 103 MPa for 1000 hours. The value of hardness and reduced modulus from nanoindentation approach indicate the occurrence of plastic and elastic deformation throughout the test.

Original languageEnglish
Title of host publicationMaterials Science Forum
PublisherTrans Tech Publications Ltd
Pages40-43
Number of pages4
Volume857
ISBN (Print)9783035710205
DOIs
Publication statusPublished - 2016
EventInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China
Duration: 4 Dec 20155 Dec 2015

Publication series

NameMaterials Science Forum
Volume857
ISSN (Print)02555476

Other

OtherInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015
CountryTaiwan, Province of China
CityKaohsiung
Period4/12/155/12/15

Fingerprint

Nanoindentation
solders
nanoindentation
Nickel
Gold
Soldering alloys
submerging
hardness
Hardness
nickel
gold
soldering
elastic deformation
Soldering
Elastic deformation
Substrates
Ointments
plastic deformation
Plastic deformation
occurrences

Keywords

  • ENIG
  • High temperature storage
  • Lead free solder
  • Mechanical properties
  • SAC305

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Bakar, M. A., Jalar @ Jalil, A., Ismail, R., & Daud, A. R. (2016). Nanoindentation of sn3.0Ag0.5Cu/ENIG solder joint after high temperature storage. In Materials Science Forum (Vol. 857, pp. 40-43). (Materials Science Forum; Vol. 857). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.857.40

Nanoindentation of sn3.0Ag0.5Cu/ENIG solder joint after high temperature storage. / Bakar, Maria Abu; Jalar @ Jalil, Azman; Ismail, Roslina; Daud, Abdul Razak.

Materials Science Forum. Vol. 857 Trans Tech Publications Ltd, 2016. p. 40-43 (Materials Science Forum; Vol. 857).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bakar, MA, Jalar @ Jalil, A, Ismail, R & Daud, AR 2016, Nanoindentation of sn3.0Ag0.5Cu/ENIG solder joint after high temperature storage. in Materials Science Forum. vol. 857, Materials Science Forum, vol. 857, Trans Tech Publications Ltd, pp. 40-43, International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, Province of China, 4/12/15. https://doi.org/10.4028/www.scientific.net/MSF.857.40
Bakar MA, Jalar @ Jalil A, Ismail R, Daud AR. Nanoindentation of sn3.0Ag0.5Cu/ENIG solder joint after high temperature storage. In Materials Science Forum. Vol. 857. Trans Tech Publications Ltd. 2016. p. 40-43. (Materials Science Forum). https://doi.org/10.4028/www.scientific.net/MSF.857.40
Bakar, Maria Abu ; Jalar @ Jalil, Azman ; Ismail, Roslina ; Daud, Abdul Razak. / Nanoindentation of sn3.0Ag0.5Cu/ENIG solder joint after high temperature storage. Materials Science Forum. Vol. 857 Trans Tech Publications Ltd, 2016. pp. 40-43 (Materials Science Forum).
@inproceedings{8e06c1447fac47bb9f8f32d9d2d98de5,
title = "Nanoindentation of sn3.0Ag0.5Cu/ENIG solder joint after high temperature storage",
abstract = "This study used nanoindentation technique in order to examine the micromechanical properties of Sn3.0Ag0.5Cu (SAC305) on Electroless Nickel Immersion Gold (ENIG) surface finished Cu substrate subjected to high temperature storage. Lead free solder paste of SAC305 were soldered on ENIG substrate by reflow soldering at 215 °C for 8 second. The soldered samples were exposed to high temperature storage at 180 °C for 0, 200, 400, 600, 800 and 1000 hours. Micromechanical properties show that the solder hardness is decreasing with the HTS time from 239.13 MPa for 0 hour to 178.96 MPa for 1000 hours while the reduce modulus results has increased from 62. 16 x 103 MPa for 0 hour to 82.13 x 103 MPa for 1000 hours. The value of hardness and reduced modulus from nanoindentation approach indicate the occurrence of plastic and elastic deformation throughout the test.",
keywords = "ENIG, High temperature storage, Lead free solder, Mechanical properties, SAC305",
author = "Bakar, {Maria Abu} and {Jalar @ Jalil}, Azman and Roslina Ismail and Daud, {Abdul Razak}",
year = "2016",
doi = "10.4028/www.scientific.net/MSF.857.40",
language = "English",
isbn = "9783035710205",
volume = "857",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd",
pages = "40--43",
booktitle = "Materials Science Forum",

}

TY - GEN

T1 - Nanoindentation of sn3.0Ag0.5Cu/ENIG solder joint after high temperature storage

AU - Bakar, Maria Abu

AU - Jalar @ Jalil, Azman

AU - Ismail, Roslina

AU - Daud, Abdul Razak

PY - 2016

Y1 - 2016

N2 - This study used nanoindentation technique in order to examine the micromechanical properties of Sn3.0Ag0.5Cu (SAC305) on Electroless Nickel Immersion Gold (ENIG) surface finished Cu substrate subjected to high temperature storage. Lead free solder paste of SAC305 were soldered on ENIG substrate by reflow soldering at 215 °C for 8 second. The soldered samples were exposed to high temperature storage at 180 °C for 0, 200, 400, 600, 800 and 1000 hours. Micromechanical properties show that the solder hardness is decreasing with the HTS time from 239.13 MPa for 0 hour to 178.96 MPa for 1000 hours while the reduce modulus results has increased from 62. 16 x 103 MPa for 0 hour to 82.13 x 103 MPa for 1000 hours. The value of hardness and reduced modulus from nanoindentation approach indicate the occurrence of plastic and elastic deformation throughout the test.

AB - This study used nanoindentation technique in order to examine the micromechanical properties of Sn3.0Ag0.5Cu (SAC305) on Electroless Nickel Immersion Gold (ENIG) surface finished Cu substrate subjected to high temperature storage. Lead free solder paste of SAC305 were soldered on ENIG substrate by reflow soldering at 215 °C for 8 second. The soldered samples were exposed to high temperature storage at 180 °C for 0, 200, 400, 600, 800 and 1000 hours. Micromechanical properties show that the solder hardness is decreasing with the HTS time from 239.13 MPa for 0 hour to 178.96 MPa for 1000 hours while the reduce modulus results has increased from 62. 16 x 103 MPa for 0 hour to 82.13 x 103 MPa for 1000 hours. The value of hardness and reduced modulus from nanoindentation approach indicate the occurrence of plastic and elastic deformation throughout the test.

KW - ENIG

KW - High temperature storage

KW - Lead free solder

KW - Mechanical properties

KW - SAC305

UR - http://www.scopus.com/inward/record.url?scp=84961251315&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84961251315&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/MSF.857.40

DO - 10.4028/www.scientific.net/MSF.857.40

M3 - Conference contribution

SN - 9783035710205

VL - 857

T3 - Materials Science Forum

SP - 40

EP - 43

BT - Materials Science Forum

PB - Trans Tech Publications Ltd

ER -