Nanoindentation creep analysis of gold ball bond

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The analysis of indentation creep of gold, Au ball bond was carried out by using nanoindentation approach. 3 × 4 arrays of indentation were indented at three location of Au ball bond namely gold, Au Zone, intermetallic compounds, IMC Zone and Silicon, Si Zone. It was observed that Au and IMC have higher creep behavior compared to that of Si. The responsible indentation creep mechanism for Au and IMC of ball bond that have been subjected 1000 hours of HTS was the dislocation glide. It was noted that the lower plastic deformation or creep effect of IMC was due to the higher hardness value which demonstrated the strain hardening effect compared to that of Au.

Original languageEnglish
Title of host publication2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings
Pages755-758
Number of pages4
DOIs
Publication statusPublished - 2012
Event2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Kuala Lumpur
Duration: 19 Sep 201221 Sep 2012

Other

Other2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012
CityKuala Lumpur
Period19/9/1221/9/12

Fingerprint

Nanoindentation
Creep
Gold
Indentation
Strain hardening
Intermetallics
Plastic deformation
Hardness
Silicon

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Zulkifli, M. N., Jalar @ Jalil, A., Abdullah, S., Othman, N. K., & Abdul Hamid, M. A. (2012). Nanoindentation creep analysis of gold ball bond. In 2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings (pp. 755-758). [6417253] https://doi.org/10.1109/SMElec.2012.6417253

Nanoindentation creep analysis of gold ball bond. / Zulkifli, Muhammad Nubli; Jalar @ Jalil, Azman; Abdullah, Shahrum; Othman, Norinsan Kamil; Abdul Hamid, Muhammad Azmi.

2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings. 2012. p. 755-758 6417253.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zulkifli, MN, Jalar @ Jalil, A, Abdullah, S, Othman, NK & Abdul Hamid, MA 2012, Nanoindentation creep analysis of gold ball bond. in 2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings., 6417253, pp. 755-758, 2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012, Kuala Lumpur, 19/9/12. https://doi.org/10.1109/SMElec.2012.6417253
Zulkifli MN, Jalar @ Jalil A, Abdullah S, Othman NK, Abdul Hamid MA. Nanoindentation creep analysis of gold ball bond. In 2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings. 2012. p. 755-758. 6417253 https://doi.org/10.1109/SMElec.2012.6417253
Zulkifli, Muhammad Nubli ; Jalar @ Jalil, Azman ; Abdullah, Shahrum ; Othman, Norinsan Kamil ; Abdul Hamid, Muhammad Azmi. / Nanoindentation creep analysis of gold ball bond. 2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings. 2012. pp. 755-758
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