Nanoindentation approach for evaluation of process parameters effect on the strength of bonded au ball bonds

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The nanoindentation test and geometry measurement have been conducted to evaluate the hardness and geometry changes of bonded Au ball bonds towards the changes of the selected wire bonding parameters namely bonding power, bonding time and bonding force. Three indentations were made on the bonded ball bonds to evaluate the variation of hardness properties with the location of indentation. It was noted that the increase of bonding or ultrasonic power will increase the hardness value for the indentations 1 and 3 located at the periphery of bonded ball bonds. The increase of bonding power also increased the deformation of bonded ball bonds. It was also shown that the increment of bonding time will increase the hardness value across the bonded ball bonds in almost even distribution. The application of the bonding force in the wire bonding process has the least effect on the hardness and geometry changes on the bonded ball bonds.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages1129-1132
Number of pages4
Volume148-149
DOIs
Publication statusPublished - 2011
Event2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010 - Shenzhen
Duration: 6 Nov 20108 Nov 2010

Publication series

NameAdvanced Materials Research
Volume148-149
ISSN (Print)10226680

Other

Other2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010
CityShenzhen
Period6/11/108/11/10

Fingerprint

Nanoindentation
Hardness
Indentation
Geometry
Wire
Ultrasonics

Keywords

  • Bond strength
  • Nanoindentation
  • Process windows
  • Wire bonding

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Abdullah, S., Zulkifli, M. N., & Jalar @ Jalil, A. (2011). Nanoindentation approach for evaluation of process parameters effect on the strength of bonded au ball bonds. In Advanced Materials Research (Vol. 148-149, pp. 1129-1132). (Advanced Materials Research; Vol. 148-149). https://doi.org/10.4028/www.scientific.net/AMR.148-149.1129

Nanoindentation approach for evaluation of process parameters effect on the strength of bonded au ball bonds. / Abdullah, Shahrum; Zulkifli, M. N.; Jalar @ Jalil, Azman.

Advanced Materials Research. Vol. 148-149 2011. p. 1129-1132 (Advanced Materials Research; Vol. 148-149).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abdullah, S, Zulkifli, MN & Jalar @ Jalil, A 2011, Nanoindentation approach for evaluation of process parameters effect on the strength of bonded au ball bonds. in Advanced Materials Research. vol. 148-149, Advanced Materials Research, vol. 148-149, pp. 1129-1132, 2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010, Shenzhen, 6/11/10. https://doi.org/10.4028/www.scientific.net/AMR.148-149.1129
Abdullah, Shahrum ; Zulkifli, M. N. ; Jalar @ Jalil, Azman. / Nanoindentation approach for evaluation of process parameters effect on the strength of bonded au ball bonds. Advanced Materials Research. Vol. 148-149 2011. pp. 1129-1132 (Advanced Materials Research).
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