Modeling and FEM simulation using fluid-structures interaction of flexible micro-bridge bending within PDMS micro-channel

Nadir Belgroune, Burhanuddin Yeop Majlis, Abdelkader Hassein-Bey, Mohamed El Amine Benamar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The manipulation of fluid flow in micro-channel with dimension of hundreds of micrometers has emerged as a distinct new field. In this paper, devices modeling and FEM simulation using Comsol Multiphysics of the fluid-structure interaction applied to PDMS micro-bridge deflection study under various fluid flow rates are presented. The introducing of fluid flow into the micro-channel causes the deflection of the microbridge. The simulation results predict a sensitive bending for low flow rate with an adapted micro-bridge dimension for each micro-channel depth. Thus demonstrate the feasibility of a new concept and open a new area of research in micro-fluidic devices and BioMEMS sensing to obtain higher sensitivity with low fluid flow rate, low coast and low power consumption.

Original languageEnglish
Title of host publicationIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages495-498
Number of pages4
ISBN (Print)9781479957606
DOIs
Publication statusPublished - 10 Oct 2014
Event11th IEEE International Conference on Semiconductor Electronics, ICSE 2014 - Kuala Lumpur
Duration: 27 Aug 201429 Aug 2014

Other

Other11th IEEE International Conference on Semiconductor Electronics, ICSE 2014
CityKuala Lumpur
Period27/8/1429/8/14

Fingerprint

Fluid structure interaction
Flow of fluids
Finite element method
Flow rate
BioMEMS
Fluidic devices
Coastal zones
Electric power utilization

Keywords

  • bending
  • FEM simulation
  • fluid flow
  • micro-bridge
  • micro-channel
  • modeling
  • PDMS
  • polydimethylsiloxane
  • Young's modulus

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Belgroune, N., Yeop Majlis, B., Hassein-Bey, A., & Benamar, M. E. A. (2014). Modeling and FEM simulation using fluid-structures interaction of flexible micro-bridge bending within PDMS micro-channel. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE (pp. 495-498). [6920906] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SMELEC.2014.6920906

Modeling and FEM simulation using fluid-structures interaction of flexible micro-bridge bending within PDMS micro-channel. / Belgroune, Nadir; Yeop Majlis, Burhanuddin; Hassein-Bey, Abdelkader; Benamar, Mohamed El Amine.

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc., 2014. p. 495-498 6920906.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Belgroune, N, Yeop Majlis, B, Hassein-Bey, A & Benamar, MEA 2014, Modeling and FEM simulation using fluid-structures interaction of flexible micro-bridge bending within PDMS micro-channel. in IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE., 6920906, Institute of Electrical and Electronics Engineers Inc., pp. 495-498, 11th IEEE International Conference on Semiconductor Electronics, ICSE 2014, Kuala Lumpur, 27/8/14. https://doi.org/10.1109/SMELEC.2014.6920906
Belgroune N, Yeop Majlis B, Hassein-Bey A, Benamar MEA. Modeling and FEM simulation using fluid-structures interaction of flexible micro-bridge bending within PDMS micro-channel. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc. 2014. p. 495-498. 6920906 https://doi.org/10.1109/SMELEC.2014.6920906
Belgroune, Nadir ; Yeop Majlis, Burhanuddin ; Hassein-Bey, Abdelkader ; Benamar, Mohamed El Amine. / Modeling and FEM simulation using fluid-structures interaction of flexible micro-bridge bending within PDMS micro-channel. IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 495-498
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