Mixed mode fracture toughness of lead-tin and tin-silver solder joints with nickel-plated substrate

Kim Shyong Siow, M. Manoharan

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

This study uses modified compact tension specimens to evaluate the fracture toughness of solder joints under a combination of tensile and shear loads. Copper substrates were coated with electroless nickel plating before they were soldered together. The samples were reflowed to peak temperatures of 215 and 240 °C for Sn-37Pb and Sn-3.5Ag, respectively, with appropriate preheating temperatures, holding time and cooling rates. Fracture toughness tests were conducted as per ASTM E399-90. Cross-sectional microstructural and fractography studies were carried out on the tested samples. Earlier fracture studies which were based on J integral as per ASTM E813-89 did not produce valid results because of brittleness of the solder joints. The current results showed that the fracture of the solder joints follows the general principles of a mixed mode fracture mechanism map and shear is the preferred mode of failure regardless of different mode of loadings, type of solders and substrate coatings.

Original languageEnglish
Pages (from-to)244-250
Number of pages7
JournalMaterials Science and Engineering A
Volume404
Issue number1-2
DOIs
Publication statusPublished - 15 Sep 2005
Externally publishedYes

Fingerprint

Tin
solders
Nickel
fracture strength
Silver
Soldering alloys
Fracture toughness
tin
Lead
silver
nickel
Substrates
J integral
fractography
shear
Nickel plating
brittleness
Fractography
Electroless plating
Preheating

Keywords

  • Fracture toughness
  • Mixed mode
  • Sn-3.5Ag
  • Sn-37Pb
  • Solder joint

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Mixed mode fracture toughness of lead-tin and tin-silver solder joints with nickel-plated substrate. / Siow, Kim Shyong; Manoharan, M.

In: Materials Science and Engineering A, Vol. 404, No. 1-2, 15.09.2005, p. 244-250.

Research output: Contribution to journalArticle

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