Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump

Muhamad Mat Salleh, Ibrahim Ahmad, Azman Jalar @ Jalil, Ghazali Omar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In electroless nickel immersion gold (ENIG) under bump metallurgy (UBM) solder bump system, the nickel UBM and solder deposition aspects, are two of the most important factors affecting the stability of solder joints. In this study solder bump shearing strength, materials interaction and inter-metallic compound (IMC) growth of Al/electroless Ni immersion gold/solder bumps were investigated with respect to multiple-reflow conditions. Three different chemical composition of lead free solder balls were used for investigate with the multiple reflow effect of 1, 2, 3, 4, 5, 7 and 10 times. Solder materials were selected for this study, were Sn3.8Ag0.7Cu, Sn0.07Cu and Sn3.5Ag, along with Sn37Pb as a reference. Results show that, shearing strength of Pb-free solders in stable condition with multiple reflow effect and indicated that Sn-Ag-Cu has the highest shearing strength and Sn-Cu is the lowest. Sn-Ag system has a compatible shearing value with the Sn-Pb. During reflow process, the formations of Ni-Sn IMC are detected at the nickel and solder material interfaces and the IMC thickness increased with multiple reflow.

Original languageEnglish
Title of host publicationProceedings - 2005 International Symposium on Microelectronics, IMAPS 2005
Pages726-730
Number of pages5
Publication statusPublished - 2005
Event38th International Symposium on Microelectronics, IMAPS 2005 - Philadelphia, PA
Duration: 25 Sep 200529 Sep 2005

Other

Other38th International Symposium on Microelectronics, IMAPS 2005
CityPhiladelphia, PA
Period25/9/0529/9/05

Fingerprint

Metallurgy
Soldering alloys
Gold
Nickel
Microstructure
Metallic compounds
Shearing
Lead-free solders
Chemical analysis

Keywords

  • Electroless nickel immersion gold (ENIG) Under bump metallurgy (UBM)
  • Intermetallic compound (IMC)
  • Microstructure
  • Multiple reflow and shear strength

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Mat Salleh, M., Ahmad, I., Jalar @ Jalil, A., & Omar, G. (2005). Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump. In Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005 (pp. 726-730)

Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump. / Mat Salleh, Muhamad; Ahmad, Ibrahim; Jalar @ Jalil, Azman; Omar, Ghazali.

Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. 2005. p. 726-730.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mat Salleh, M, Ahmad, I, Jalar @ Jalil, A & Omar, G 2005, Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump. in Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. pp. 726-730, 38th International Symposium on Microelectronics, IMAPS 2005, Philadelphia, PA, 25/9/05.
Mat Salleh M, Ahmad I, Jalar @ Jalil A, Omar G. Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump. In Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. 2005. p. 726-730
Mat Salleh, Muhamad ; Ahmad, Ibrahim ; Jalar @ Jalil, Azman ; Omar, Ghazali. / Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump. Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. 2005. pp. 726-730
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