Microstructure of solder joint interconnect in used mobile phone

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A tin-lead solder is generally used to mount an electronic package on to a printed circuit board (PCB) of an electronic devices. In this study, we investigated the microstructure of the solder joint from a four years old used mobile phone. Microstructure and morphology of the joint was obtained using optical and scanning electron microscopy (OM and SEM) respectively. Cracks and voids can clearly be seen in the solder area for the most of the sample observed. Crack up to 10 μm wide appeared to be propagating along the solder line between Cu lead and Cu substrate. Energy dispersive X-ray (EDX) analysis revealed that cracks occurred at the richer tin content. It was not clear the exact mechanism that leads to the existence of the crack. However we believe that thermomechanical cause such as thermal fatigue, void formation and the thicker layer of intermetallic compound contributed to the failure of the solder joint.

Original languageEnglish
Title of host publicationMaterials Science Forum
Pages123-128
Number of pages6
Volume517
DOIs
Publication statusPublished - 2006
EventInternational Conference on Functional Materials and Devices, ICFMD-2005 - Kuala Lumpur
Duration: 6 Jun 20058 Jun 2005

Publication series

NameMaterials Science Forum
Volume517
ISSN (Print)02555476

Other

OtherInternational Conference on Functional Materials and Devices, ICFMD-2005
CityKuala Lumpur
Period6/6/058/6/05

Fingerprint

Mobile phones
Soldering alloys
Microstructure
Cracks
Tin
Lead
Scanning electron microscopy
Thermal fatigue
Energy dispersive X ray analysis
Printed circuit boards
Intermetallics
Substrates

Keywords

  • Crack propagation
  • Solder microstructure
  • Void formation

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Shahdan, S. N., Jalar @ Jalil, A., & Abdul Hamid, M. A. (2006). Microstructure of solder joint interconnect in used mobile phone. In Materials Science Forum (Vol. 517, pp. 123-128). (Materials Science Forum; Vol. 517). https://doi.org/10.4028/0-87849-404-9.123

Microstructure of solder joint interconnect in used mobile phone. / Shahdan, Shahrul Nizam; Jalar @ Jalil, Azman; Abdul Hamid, Muhammad Azmi.

Materials Science Forum. Vol. 517 2006. p. 123-128 (Materials Science Forum; Vol. 517).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Shahdan, SN, Jalar @ Jalil, A & Abdul Hamid, MA 2006, Microstructure of solder joint interconnect in used mobile phone. in Materials Science Forum. vol. 517, Materials Science Forum, vol. 517, pp. 123-128, International Conference on Functional Materials and Devices, ICFMD-2005, Kuala Lumpur, 6/6/05. https://doi.org/10.4028/0-87849-404-9.123
Shahdan SN, Jalar @ Jalil A, Abdul Hamid MA. Microstructure of solder joint interconnect in used mobile phone. In Materials Science Forum. Vol. 517. 2006. p. 123-128. (Materials Science Forum). https://doi.org/10.4028/0-87849-404-9.123
Shahdan, Shahrul Nizam ; Jalar @ Jalil, Azman ; Abdul Hamid, Muhammad Azmi. / Microstructure of solder joint interconnect in used mobile phone. Materials Science Forum. Vol. 517 2006. pp. 123-128 (Materials Science Forum).
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