Microstructural studies on fire-through front contact metallization of Si solar cells

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Screen-printed Silver/Argentum (Ag) metallization is used in the photovoltaic industry for the front-side emitter contacts of crystalline silicon solar cells owing to its cost-effectiveness and high throughput. In order to obtain a better understanding for the formation of Ag paste and silicon (Si) interface, the firing treatment was studied. The microstructure properties of the fire-through Ag metal contacts formed on pyramid textured silicon wafers are investigated. The best firing temperature is 800 C with an open circuit voltage at 0.504V and efficiency of 13.67%. The Scanning Electron Microscopy (SEM) characterization of Ag shows that as the temperature further increased, the particles of Ag fuse together and the decrease of the Ag thin film thickness indicates that n layer has been formed.

Original languageEnglish
Title of host publication2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts
Pages364-367
Number of pages4
DOIs
Publication statusPublished - 2011
Event2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011 - Kota Kinabalu, Sabah
Duration: 28 Sep 201130 Sep 2011

Other

Other2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011
CityKota Kinabalu, Sabah
Period28/9/1130/9/11

Fingerprint

Silicon solar cells
Metallizing
Fires
Electric fuses
Open circuit voltage
Cost effectiveness
Silicon wafers
Film thickness
Silver
Throughput
Crystalline materials
Thin films
Silicon
Temperature
Microstructure
Scanning electron microscopy
Metals
Industry

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Sepeai, S., Sulaiman, M. Y., Zaidi, S. H., & Sopian, K. (2011). Microstructural studies on fire-through front contact metallization of Si solar cells. In 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts (pp. 364-367). [6088361] https://doi.org/10.1109/RSM.2011.6088361

Microstructural studies on fire-through front contact metallization of Si solar cells. / Sepeai, Suhaila; Sulaiman, M. Y.; Zaidi, Saleem H.; Sopian, Kamaruzzaman.

2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts. 2011. p. 364-367 6088361.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sepeai, S, Sulaiman, MY, Zaidi, SH & Sopian, K 2011, Microstructural studies on fire-through front contact metallization of Si solar cells. in 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts., 6088361, pp. 364-367, 2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011, Kota Kinabalu, Sabah, 28/9/11. https://doi.org/10.1109/RSM.2011.6088361
Sepeai S, Sulaiman MY, Zaidi SH, Sopian K. Microstructural studies on fire-through front contact metallization of Si solar cells. In 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts. 2011. p. 364-367. 6088361 https://doi.org/10.1109/RSM.2011.6088361
Sepeai, Suhaila ; Sulaiman, M. Y. ; Zaidi, Saleem H. ; Sopian, Kamaruzzaman. / Microstructural studies on fire-through front contact metallization of Si solar cells. 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts. 2011. pp. 364-367
@inproceedings{bba625961f304e3395e02488a2128364,
title = "Microstructural studies on fire-through front contact metallization of Si solar cells",
abstract = "Screen-printed Silver/Argentum (Ag) metallization is used in the photovoltaic industry for the front-side emitter contacts of crystalline silicon solar cells owing to its cost-effectiveness and high throughput. In order to obtain a better understanding for the formation of Ag paste and silicon (Si) interface, the firing treatment was studied. The microstructure properties of the fire-through Ag metal contacts formed on pyramid textured silicon wafers are investigated. The best firing temperature is 800 C with an open circuit voltage at 0.504V and efficiency of 13.67{\%}. The Scanning Electron Microscopy (SEM) characterization of Ag shows that as the temperature further increased, the particles of Ag fuse together and the decrease of the Ag thin film thickness indicates that n layer has been formed.",
author = "Suhaila Sepeai and Sulaiman, {M. Y.} and Zaidi, {Saleem H.} and Kamaruzzaman Sopian",
year = "2011",
doi = "10.1109/RSM.2011.6088361",
language = "English",
isbn = "9781612848464",
pages = "364--367",
booktitle = "2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts",

}

TY - GEN

T1 - Microstructural studies on fire-through front contact metallization of Si solar cells

AU - Sepeai, Suhaila

AU - Sulaiman, M. Y.

AU - Zaidi, Saleem H.

AU - Sopian, Kamaruzzaman

PY - 2011

Y1 - 2011

N2 - Screen-printed Silver/Argentum (Ag) metallization is used in the photovoltaic industry for the front-side emitter contacts of crystalline silicon solar cells owing to its cost-effectiveness and high throughput. In order to obtain a better understanding for the formation of Ag paste and silicon (Si) interface, the firing treatment was studied. The microstructure properties of the fire-through Ag metal contacts formed on pyramid textured silicon wafers are investigated. The best firing temperature is 800 C with an open circuit voltage at 0.504V and efficiency of 13.67%. The Scanning Electron Microscopy (SEM) characterization of Ag shows that as the temperature further increased, the particles of Ag fuse together and the decrease of the Ag thin film thickness indicates that n layer has been formed.

AB - Screen-printed Silver/Argentum (Ag) metallization is used in the photovoltaic industry for the front-side emitter contacts of crystalline silicon solar cells owing to its cost-effectiveness and high throughput. In order to obtain a better understanding for the formation of Ag paste and silicon (Si) interface, the firing treatment was studied. The microstructure properties of the fire-through Ag metal contacts formed on pyramid textured silicon wafers are investigated. The best firing temperature is 800 C with an open circuit voltage at 0.504V and efficiency of 13.67%. The Scanning Electron Microscopy (SEM) characterization of Ag shows that as the temperature further increased, the particles of Ag fuse together and the decrease of the Ag thin film thickness indicates that n layer has been formed.

UR - http://www.scopus.com/inward/record.url?scp=83755194776&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=83755194776&partnerID=8YFLogxK

U2 - 10.1109/RSM.2011.6088361

DO - 10.1109/RSM.2011.6088361

M3 - Conference contribution

AN - SCOPUS:83755194776

SN - 9781612848464

SP - 364

EP - 367

BT - 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts

ER -