Mechanical properties of nano-silver joints as die attach materials

Research output: Contribution to journalArticle

210 Citations (Scopus)

Abstract

This review traces the development of silver (Ag) as a die attach bonding material in the microelectronic packaging industry from its' early days as micron-scale silver flakes to the recent nanoscale Ag paste and other derivatives. Basic materials properties include the composition of Ag pastes, the methods of producing Ag nanoparticles, and product applications will be presented. Key processing conditions will be discussed to elucidate different factors which influence the mechanical properties of nano-Ag joints, principally the tensile and shear strength as well as thermal fatigue properties. Success in implementing nano-scale Ag pastes could only have been possible by deriving a fundamental understanding developed in the field of processing and using ceramic and metallic nano-powders.

Original languageEnglish
Pages (from-to)6-19
Number of pages14
JournalJournal of Alloys and Compounds
Volume514
DOIs
Publication statusPublished - 15 Feb 2012
Externally publishedYes

Fingerprint

Ointments
Silver
Mechanical properties
Thermal fatigue
Processing
Microelectronics
Shear strength
Materials properties
Packaging
Tensile strength
Nanoparticles
Derivatives
Powders
Chemical analysis
Industry

Keywords

  • Ag nanoparticles
  • Lead free die attach
  • Mechanical properties
  • Sintering

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Materials Chemistry
  • Metals and Alloys

Cite this

Mechanical properties of nano-silver joints as die attach materials. / Siow, Kim Shyong.

In: Journal of Alloys and Compounds, Vol. 514, 15.02.2012, p. 6-19.

Research output: Contribution to journalArticle

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