Mechanical interlocking on leadframe surface for bondability of Au wedge bond

Roslina Ismail, Fuaida Harun, Azman Jalar @ Jalil, Shahrum Abdullah

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work is a contribution towards the understanding of wire bond integrity and reliability in relation to their microstructural and mechanical properties in semiconductor packaging.The effect of surface roughness and hardness of leadframe on the bondability of Au wedge bond still requires detail analysis. Two type of leadframes namely leadframe A and leadframe B were chosen and scanning electron microscope (SEM) and optical microscope were used to inspect the surface morphology of leadframes and the quality of created Au wedge bond after wire bonding process. It was found that there were significant differences in the surface morphologies between these two leadframes. The atomic force microscopy (AFM) which was utilized to measure the average roughness, Ra of lead finger confirms that leadframe A has the highest Ra with value of 166.46 nm compared to that of leadframe B with value of 85.89 nm. While hardness value of different lead finger from the selected leadframe A and B obtained using Vicker microhardness tester are 180.9 VH and 154.2VH respectively.

Original languageEnglish
Title of host publicationMaterials Science Forum
PublisherTrans Tech Publications Ltd
Pages79-82
Number of pages4
Volume857
ISBN (Print)9783035710205
DOIs
Publication statusPublished - 2016
EventInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China
Duration: 4 Dec 20155 Dec 2015

Publication series

NameMaterials Science Forum
Volume857
ISSN (Print)02555476

Other

OtherInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015
CountryTaiwan, Province of China
CityKaohsiung
Period4/12/155/12/15

Fingerprint

wedges
locking
Surface morphology
hardness
Lead
Surface roughness
Hardness
wire
Wire
optical microscopes
test equipment
packaging
Microhardness
microhardness
integrity
Atomic force microscopy
Packaging
surface roughness
Microscopes
Electron microscopes

Keywords

  • Au wedge bond
  • Bondability
  • Ultrasonic vibration
  • Wire bonding

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Ismail, R., Harun, F., Jalar @ Jalil, A., & Abdullah, S. (2016). Mechanical interlocking on leadframe surface for bondability of Au wedge bond. In Materials Science Forum (Vol. 857, pp. 79-82). (Materials Science Forum; Vol. 857). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.857.79

Mechanical interlocking on leadframe surface for bondability of Au wedge bond. / Ismail, Roslina; Harun, Fuaida; Jalar @ Jalil, Azman; Abdullah, Shahrum.

Materials Science Forum. Vol. 857 Trans Tech Publications Ltd, 2016. p. 79-82 (Materials Science Forum; Vol. 857).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ismail, R, Harun, F, Jalar @ Jalil, A & Abdullah, S 2016, Mechanical interlocking on leadframe surface for bondability of Au wedge bond. in Materials Science Forum. vol. 857, Materials Science Forum, vol. 857, Trans Tech Publications Ltd, pp. 79-82, International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, Province of China, 4/12/15. https://doi.org/10.4028/www.scientific.net/MSF.857.79
Ismail R, Harun F, Jalar @ Jalil A, Abdullah S. Mechanical interlocking on leadframe surface for bondability of Au wedge bond. In Materials Science Forum. Vol. 857. Trans Tech Publications Ltd. 2016. p. 79-82. (Materials Science Forum). https://doi.org/10.4028/www.scientific.net/MSF.857.79
Ismail, Roslina ; Harun, Fuaida ; Jalar @ Jalil, Azman ; Abdullah, Shahrum. / Mechanical interlocking on leadframe surface for bondability of Au wedge bond. Materials Science Forum. Vol. 857 Trans Tech Publications Ltd, 2016. pp. 79-82 (Materials Science Forum).
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