Mechanical analysis of condenser microphone based on silicon carbide diaphragm for sonic detection

Siti Aisyah Zawawi, Azrul Azlan Hamzah, Burhanuddin Yeop Majlis, Faisal Mohd-Yasin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new design of microelectromechanical systems (MEMS) condenser microphone employing silicon carbide (SiC) diaphragm is proposed for the sonic detection. The sensing structure consists of SiC thin film as the top plate and perforated Si as the back plate. The numerical analysis and simulation studies compare the mechanical performances of the square-shape SiC diaphragm. Four parameters are considered i.e. resonance frequency, cutoff frequency, maximum deflection and maximum stress. The theoretical and simulated results match closely. Overall, the 680 μm × 680 μm SiC diaphragm with the thickness of 1.00 μm gives the optimized mechanical performances for the sonic detection.

Original languageEnglish
Title of host publication2016 IEEE International Conference on Semiconductor Electronics, ICSE 2016 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages25-28
Number of pages4
Volume2016-September
ISBN (Electronic)9781509023837
DOIs
Publication statusPublished - 21 Sep 2016
Event12th IEEE International Conference on Semiconductor Electronics, ICSE 2016 - Bangsar, Kuala Lumpur, Malaysia
Duration: 17 Aug 201619 Aug 2016

Other

Other12th IEEE International Conference on Semiconductor Electronics, ICSE 2016
CountryMalaysia
CityBangsar, Kuala Lumpur
Period17/8/1619/8/16

Fingerprint

Microphones
Diaphragms
Silicon carbide
Cutoff frequency
MEMS
Numerical analysis
Thin films
silicon carbide
Computer simulation

Keywords

  • condenser microphone
  • deflection
  • frequency response
  • silicon carbide (SiC)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Zawawi, S. A., Hamzah, A. A., Yeop Majlis, B., & Mohd-Yasin, F. (2016). Mechanical analysis of condenser microphone based on silicon carbide diaphragm for sonic detection. In 2016 IEEE International Conference on Semiconductor Electronics, ICSE 2016 - Proceedings (Vol. 2016-September, pp. 25-28). [7573582] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SMELEC.2016.7573582

Mechanical analysis of condenser microphone based on silicon carbide diaphragm for sonic detection. / Zawawi, Siti Aisyah; Hamzah, Azrul Azlan; Yeop Majlis, Burhanuddin; Mohd-Yasin, Faisal.

2016 IEEE International Conference on Semiconductor Electronics, ICSE 2016 - Proceedings. Vol. 2016-September Institute of Electrical and Electronics Engineers Inc., 2016. p. 25-28 7573582.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zawawi, SA, Hamzah, AA, Yeop Majlis, B & Mohd-Yasin, F 2016, Mechanical analysis of condenser microphone based on silicon carbide diaphragm for sonic detection. in 2016 IEEE International Conference on Semiconductor Electronics, ICSE 2016 - Proceedings. vol. 2016-September, 7573582, Institute of Electrical and Electronics Engineers Inc., pp. 25-28, 12th IEEE International Conference on Semiconductor Electronics, ICSE 2016, Bangsar, Kuala Lumpur, Malaysia, 17/8/16. https://doi.org/10.1109/SMELEC.2016.7573582
Zawawi SA, Hamzah AA, Yeop Majlis B, Mohd-Yasin F. Mechanical analysis of condenser microphone based on silicon carbide diaphragm for sonic detection. In 2016 IEEE International Conference on Semiconductor Electronics, ICSE 2016 - Proceedings. Vol. 2016-September. Institute of Electrical and Electronics Engineers Inc. 2016. p. 25-28. 7573582 https://doi.org/10.1109/SMELEC.2016.7573582
Zawawi, Siti Aisyah ; Hamzah, Azrul Azlan ; Yeop Majlis, Burhanuddin ; Mohd-Yasin, Faisal. / Mechanical analysis of condenser microphone based on silicon carbide diaphragm for sonic detection. 2016 IEEE International Conference on Semiconductor Electronics, ICSE 2016 - Proceedings. Vol. 2016-September Institute of Electrical and Electronics Engineers Inc., 2016. pp. 25-28
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