Low-temperature CMOS-compatible 3D-integration of monocrystalline-silicon based PZT RF MEMS switch actuators on RF substrates

Farizah Saharil, Robert V. Wright, Pekka Rantakari, Paul B. Kirby, Tauno Vähä-Heikkilä, Frank Niklaus, Göran Stemme, Joachim Oberhammer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

This paper presents a low temperature (200°C) CMOS-compatible fabrication process for integrating high-temperature deposited lead zirconate titanate (PZT) on thin film monocrystalline-silicon piezoelectric actuators, onto an RF substrate, and successful demonstration of this process for fabrication of metal-contact RF-MEMS switches. The patterned PZT/silicon multi-layer stack is transfer-bonded from a silicon-on-insulator (SOI) donor wafer to an AF-45 glass RF substrate using adhesive wafer transfer bonding. Furthermore, several strategies have been investigated to drastically reduce the post bonding misalignment created by the shear forces between the bonding chucks during wafer bonding.

Original languageEnglish
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages47-50
Number of pages4
DOIs
Publication statusPublished - 2010
Externally publishedYes
Event23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 - Hong Kong
Duration: 24 Jan 201028 Jan 2010

Other

Other23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
CityHong Kong
Period24/1/1028/1/10

Fingerprint

Monocrystalline silicon
microelectromechanical systems
MEMS
CMOS
Actuators
switches
actuators
Switches
Silicon
wafers
silicon
Substrates
Chucks
Fabrication
Wafer bonding
Piezoelectric actuators
Temperature
fabrication
piezoelectric actuators
Adhesives

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Saharil, F., Wright, R. V., Rantakari, P., Kirby, P. B., Vähä-Heikkilä, T., Niklaus, F., ... Oberhammer, J. (2010). Low-temperature CMOS-compatible 3D-integration of monocrystalline-silicon based PZT RF MEMS switch actuators on RF substrates. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 47-50). [5442568] https://doi.org/10.1109/MEMSYS.2010.5442568

Low-temperature CMOS-compatible 3D-integration of monocrystalline-silicon based PZT RF MEMS switch actuators on RF substrates. / Saharil, Farizah; Wright, Robert V.; Rantakari, Pekka; Kirby, Paul B.; Vähä-Heikkilä, Tauno; Niklaus, Frank; Stemme, Göran; Oberhammer, Joachim.

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2010. p. 47-50 5442568.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Saharil, F, Wright, RV, Rantakari, P, Kirby, PB, Vähä-Heikkilä, T, Niklaus, F, Stemme, G & Oberhammer, J 2010, Low-temperature CMOS-compatible 3D-integration of monocrystalline-silicon based PZT RF MEMS switch actuators on RF substrates. in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)., 5442568, pp. 47-50, 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010, Hong Kong, 24/1/10. https://doi.org/10.1109/MEMSYS.2010.5442568
Saharil F, Wright RV, Rantakari P, Kirby PB, Vähä-Heikkilä T, Niklaus F et al. Low-temperature CMOS-compatible 3D-integration of monocrystalline-silicon based PZT RF MEMS switch actuators on RF substrates. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2010. p. 47-50. 5442568 https://doi.org/10.1109/MEMSYS.2010.5442568
Saharil, Farizah ; Wright, Robert V. ; Rantakari, Pekka ; Kirby, Paul B. ; Vähä-Heikkilä, Tauno ; Niklaus, Frank ; Stemme, Göran ; Oberhammer, Joachim. / Low-temperature CMOS-compatible 3D-integration of monocrystalline-silicon based PZT RF MEMS switch actuators on RF substrates. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2010. pp. 47-50
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