Low temperature "click" wafer bonding of off-stoichiometry thiol-ene (OSTE) polymers to silicon

C. F. Carlborg, F. Saharil, T. Haraldsson, W. Van Der Wijngaart

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We present a low temperature (< 37°C) wafer-scale microfluidic batch packaging process using covalent, dry bonding of offstoichiometry thiol-ene polymers (OSTE), enabling rapid, bio-compatible integration of fluidics on wafer-scale in combination with excellent polymer properties.

Original languageEnglish
Title of host publication15th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2011, MicroTAS 2011
Pages1143-1145
Number of pages3
Volume2
Publication statusPublished - 2011
Externally publishedYes
Event15th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2011, MicroTAS 2011 - Seattle, WA
Duration: 2 Oct 20116 Oct 2011

Other

Other15th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2011, MicroTAS 2011
CitySeattle, WA
Period2/10/116/10/11

Fingerprint

Wafer bonding
Stoichiometry
Silicon
Fluidics
Polymers
Microfluidics
Packaging
Temperature

Keywords

  • Biocompatible
  • Off-stoichiometry thiol-ene (OSTE)
  • Packaging
  • Wafer-scale bonding

ASJC Scopus subject areas

  • Control and Systems Engineering

Cite this

Carlborg, C. F., Saharil, F., Haraldsson, T., & Van Der Wijngaart, W. (2011). Low temperature "click" wafer bonding of off-stoichiometry thiol-ene (OSTE) polymers to silicon. In 15th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2011, MicroTAS 2011 (Vol. 2, pp. 1143-1145)

Low temperature "click" wafer bonding of off-stoichiometry thiol-ene (OSTE) polymers to silicon. / Carlborg, C. F.; Saharil, F.; Haraldsson, T.; Van Der Wijngaart, W.

15th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2011, MicroTAS 2011. Vol. 2 2011. p. 1143-1145.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Carlborg, CF, Saharil, F, Haraldsson, T & Van Der Wijngaart, W 2011, Low temperature "click" wafer bonding of off-stoichiometry thiol-ene (OSTE) polymers to silicon. in 15th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2011, MicroTAS 2011. vol. 2, pp. 1143-1145, 15th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2011, MicroTAS 2011, Seattle, WA, 2/10/11.
Carlborg CF, Saharil F, Haraldsson T, Van Der Wijngaart W. Low temperature "click" wafer bonding of off-stoichiometry thiol-ene (OSTE) polymers to silicon. In 15th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2011, MicroTAS 2011. Vol. 2. 2011. p. 1143-1145
Carlborg, C. F. ; Saharil, F. ; Haraldsson, T. ; Van Der Wijngaart, W. / Low temperature "click" wafer bonding of off-stoichiometry thiol-ene (OSTE) polymers to silicon. 15th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2011, MicroTAS 2011. Vol. 2 2011. pp. 1143-1145
@inproceedings{decb548eca55406c859a0fb50c0a937f,
title = "Low temperature {"}click{"} wafer bonding of off-stoichiometry thiol-ene (OSTE) polymers to silicon",
abstract = "We present a low temperature (< 37°C) wafer-scale microfluidic batch packaging process using covalent, dry bonding of offstoichiometry thiol-ene polymers (OSTE), enabling rapid, bio-compatible integration of fluidics on wafer-scale in combination with excellent polymer properties.",
keywords = "Biocompatible, Off-stoichiometry thiol-ene (OSTE), Packaging, Wafer-scale bonding",
author = "Carlborg, {C. F.} and F. Saharil and T. Haraldsson and {Van Der Wijngaart}, W.",
year = "2011",
language = "English",
isbn = "9781618395955",
volume = "2",
pages = "1143--1145",
booktitle = "15th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2011, MicroTAS 2011",

}

TY - GEN

T1 - Low temperature "click" wafer bonding of off-stoichiometry thiol-ene (OSTE) polymers to silicon

AU - Carlborg, C. F.

AU - Saharil, F.

AU - Haraldsson, T.

AU - Van Der Wijngaart, W.

PY - 2011

Y1 - 2011

N2 - We present a low temperature (< 37°C) wafer-scale microfluidic batch packaging process using covalent, dry bonding of offstoichiometry thiol-ene polymers (OSTE), enabling rapid, bio-compatible integration of fluidics on wafer-scale in combination with excellent polymer properties.

AB - We present a low temperature (< 37°C) wafer-scale microfluidic batch packaging process using covalent, dry bonding of offstoichiometry thiol-ene polymers (OSTE), enabling rapid, bio-compatible integration of fluidics on wafer-scale in combination with excellent polymer properties.

KW - Biocompatible

KW - Off-stoichiometry thiol-ene (OSTE)

KW - Packaging

KW - Wafer-scale bonding

UR - http://www.scopus.com/inward/record.url?scp=84883797908&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84883797908&partnerID=8YFLogxK

M3 - Conference contribution

SN - 9781618395955

VL - 2

SP - 1143

EP - 1145

BT - 15th International Conference on Miniaturized Systems for Chemistry and Life Sciences 2011, MicroTAS 2011

ER -