KOH etching process of perfect square MEMS corrugated diaphragm 60371Z

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper, silicon corrugated diaphragms with non-compensated and compensated mask layout have been fabricated on a single silicon (100) wafer by using potassium hydroxide (KOH) etching technique. Although, recently corrugated diaphragms have been used for a diaphragm structure due to its excellent properties, no theoretical and analytical studies on the fabrication process of these diaphragms have been performed. Therefore, the characterization of the KOH etching process with emphasized on convex corner behavior has been studied through both experiments and simulations in order to realize the perfect corrugated diaphragm. Details of the etching of corrugated diaphragms have been studied by using process simulation software of a three-dimensional anisotropic etching profile prior to fabrication process. The influence of the KOH etching temperature and concentration on the convex corner undercutting of corrugated diaphragm are observed. The convex corner behavior has been analyzed based on the geometrical parameters and the new emergent high index silicon planes. It was found that the convex corner undercutting phenomena is significantly reduced at low etching temperature and high KOH concentration respectively. It can be concluded that the prominent facets contributing to the undercutting of the convex corners of the corrugated diaphragm for the given etching condition coincide with the {411} plane. The introduction of the additional mask layout for the protection of convex corners at all convex-mask geometry of the corrugated diaphragm during the KOH etching process has been proved by simulation to produce almost perfect square corners. These simulation results have been confirmed by experiments.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsJ.-C. Chiao, A.S. Dzurak, C. Jagadish, D.V. Thiel
Volume6037
DOIs
Publication statusPublished - 2006
EventDevice and Process Technologies for Microelectronics, MEMS, and Photonics IV - Brisbane, Australia
Duration: 12 Dec 200514 Dec 2005

Other

OtherDevice and Process Technologies for Microelectronics, MEMS, and Photonics IV
CountryAustralia
CityBrisbane
Period12/12/0514/12/05

Fingerprint

diaphragms
Diaphragms
microelectromechanical systems
MEMS
Etching
etching
Masks
masks
layouts
silicon
simulation
Fabrication
potassium hydroxides
Anisotropic etching
Potassium hydroxide
Silicon
fabrication
Silicon wafers
flat surfaces
Experiments

Keywords

  • Anisotropic etching profile
  • Compensated mask-layout
  • Convex corner
  • Corrugated diaphragm
  • High index silicon planes
  • KOH etching technique
  • Undercutting

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Soin, N., & Yeop Majlis, B. (2006). KOH etching process of perfect square MEMS corrugated diaphragm 60371Z. In J-C. Chiao, A. S. Dzurak, C. Jagadish, & D. V. Thiel (Eds.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 6037). [60371Z] https://doi.org/10.1117/12.637586

KOH etching process of perfect square MEMS corrugated diaphragm 60371Z. / Soin, N.; Yeop Majlis, Burhanuddin.

Proceedings of SPIE - The International Society for Optical Engineering. ed. / J.-C. Chiao; A.S. Dzurak; C. Jagadish; D.V. Thiel. Vol. 6037 2006. 60371Z.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soin, N & Yeop Majlis, B 2006, KOH etching process of perfect square MEMS corrugated diaphragm 60371Z. in J-C Chiao, AS Dzurak, C Jagadish & DV Thiel (eds), Proceedings of SPIE - The International Society for Optical Engineering. vol. 6037, 60371Z, Device and Process Technologies for Microelectronics, MEMS, and Photonics IV, Brisbane, Australia, 12/12/05. https://doi.org/10.1117/12.637586
Soin N, Yeop Majlis B. KOH etching process of perfect square MEMS corrugated diaphragm 60371Z. In Chiao J-C, Dzurak AS, Jagadish C, Thiel DV, editors, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6037. 2006. 60371Z https://doi.org/10.1117/12.637586
Soin, N. ; Yeop Majlis, Burhanuddin. / KOH etching process of perfect square MEMS corrugated diaphragm 60371Z. Proceedings of SPIE - The International Society for Optical Engineering. editor / J.-C. Chiao ; A.S. Dzurak ; C. Jagadish ; D.V. Thiel. Vol. 6037 2006.
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