Investigation of thermal properties of Al-Si matrix reinforced fine SiCp composites

Y. Abdullah, A. R. Daud, M. Harun, Roslinda Shamsudin

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The characterisation of thermal expansion coefficient and thermal conductivity of Al-Si matrix alloy and Al-Si alloy reinforced with fine SiC p (5 and 20 wt-%) composites fabricated by stir casting process are investigated. The results show that with increasing temperature up to 350°C, thermal expansion of composites increases and slowly reduces when the temperature reaches to 500°C. The values of both thermal expansion and conductivity of composites are less than those for Al-Si matrix. Microstructure and particles/matrix interface properties play an important role in the thermal properties of composites. Thermal properties of composites are strongly dependent on the weight percentage of SiCp.

Original languageEnglish
Pages (from-to)1518-1520
Number of pages3
JournalMaterials Science and Technology
Volume26
Issue number12
DOIs
Publication statusPublished - 1 Dec 2010

Fingerprint

Thermodynamic properties
thermodynamic properties
composite materials
Composite materials
Thermal expansion
matrices
thermal expansion
Thermal conductivity
thermal conductivity
Casting
conductivity
Temperature
microstructure
Microstructure
temperature
coefficients

Keywords

  • Al-Si/Sicp Composites
  • Characterisation
  • Thermal Properties

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Investigation of thermal properties of Al-Si matrix reinforced fine SiCp composites. / Abdullah, Y.; Daud, A. R.; Harun, M.; Shamsudin, Roslinda.

In: Materials Science and Technology, Vol. 26, No. 12, 01.12.2010, p. 1518-1520.

Research output: Contribution to journalArticle

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