Investigation of simple process technology for the fabrication of valveless micropumps

Jumril Yunas, Juliana Johari, A. R. Bahadorimehr, I. C. Gebeshuber, Burhanuddin Yeop Majlis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

This paper presents a simple process technique for the fabrication of valveless micropumps. The process design utilizes standard MEMS process using double-sided anisotropic silicon wet etching process with an additional adhesive bonding technique. The diffuser and nozzle element of the pump with depth of 50 μm, as well as a 150 μm thick silicon membrane are designed and fabricated using only 3 patterning process steps. A piezoelectric plate working at the frequency range from 0.1 kHz to 2 kHz is bonded on to the back side of the silicon membrane to create the membrane actuation. The patterning process of thick photoresist used as the adhesive layer for the substrate bonding is also discussed in detail. The fluid flow is observed and the process reproducibility is proven which show a good prospect for the future development of miniaturized valveless pump for biomedical application.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages211-214
Number of pages4
Volume254
DOIs
Publication statusPublished - 2011
EventInternational Conference on Materials for Advanced Technologies, ICMAT2011 - Symposium G: NEMS/MEMS and MicroTAS - Suntec
Duration: 26 Jun 20111 Jul 2011

Publication series

NameAdvanced Materials Research
Volume254
ISSN (Print)10226680

Other

OtherInternational Conference on Materials for Advanced Technologies, ICMAT2011 - Symposium G: NEMS/MEMS and MicroTAS
CitySuntec
Period26/6/111/7/11

Fingerprint

Membranes
Fabrication
Silicon
Adhesives
Pumps
Wet etching
Photoresists
MEMS
Flow of fluids
Process design
Nozzles
Substrates

Keywords

  • Adhesive bonding
  • MEMS
  • Valveless micropump
  • Wet etching

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Yunas, J., Johari, J., Bahadorimehr, A. R., Gebeshuber, I. C., & Yeop Majlis, B. (2011). Investigation of simple process technology for the fabrication of valveless micropumps. In Advanced Materials Research (Vol. 254, pp. 211-214). (Advanced Materials Research; Vol. 254). https://doi.org/10.4028/www.scientific.net/AMR.254.211

Investigation of simple process technology for the fabrication of valveless micropumps. / Yunas, Jumril; Johari, Juliana; Bahadorimehr, A. R.; Gebeshuber, I. C.; Yeop Majlis, Burhanuddin.

Advanced Materials Research. Vol. 254 2011. p. 211-214 (Advanced Materials Research; Vol. 254).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yunas, J, Johari, J, Bahadorimehr, AR, Gebeshuber, IC & Yeop Majlis, B 2011, Investigation of simple process technology for the fabrication of valveless micropumps. in Advanced Materials Research. vol. 254, Advanced Materials Research, vol. 254, pp. 211-214, International Conference on Materials for Advanced Technologies, ICMAT2011 - Symposium G: NEMS/MEMS and MicroTAS, Suntec, 26/6/11. https://doi.org/10.4028/www.scientific.net/AMR.254.211
Yunas J, Johari J, Bahadorimehr AR, Gebeshuber IC, Yeop Majlis B. Investigation of simple process technology for the fabrication of valveless micropumps. In Advanced Materials Research. Vol. 254. 2011. p. 211-214. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.254.211
Yunas, Jumril ; Johari, Juliana ; Bahadorimehr, A. R. ; Gebeshuber, I. C. ; Yeop Majlis, Burhanuddin. / Investigation of simple process technology for the fabrication of valveless micropumps. Advanced Materials Research. Vol. 254 2011. pp. 211-214 (Advanced Materials Research).
@inproceedings{42ba85a73d4f4be4afaf989d7d64d6b5,
title = "Investigation of simple process technology for the fabrication of valveless micropumps",
abstract = "This paper presents a simple process technique for the fabrication of valveless micropumps. The process design utilizes standard MEMS process using double-sided anisotropic silicon wet etching process with an additional adhesive bonding technique. The diffuser and nozzle element of the pump with depth of 50 μm, as well as a 150 μm thick silicon membrane are designed and fabricated using only 3 patterning process steps. A piezoelectric plate working at the frequency range from 0.1 kHz to 2 kHz is bonded on to the back side of the silicon membrane to create the membrane actuation. The patterning process of thick photoresist used as the adhesive layer for the substrate bonding is also discussed in detail. The fluid flow is observed and the process reproducibility is proven which show a good prospect for the future development of miniaturized valveless pump for biomedical application.",
keywords = "Adhesive bonding, MEMS, Valveless micropump, Wet etching",
author = "Jumril Yunas and Juliana Johari and Bahadorimehr, {A. R.} and Gebeshuber, {I. C.} and {Yeop Majlis}, Burhanuddin",
year = "2011",
doi = "10.4028/www.scientific.net/AMR.254.211",
language = "English",
isbn = "9783037851456",
volume = "254",
series = "Advanced Materials Research",
pages = "211--214",
booktitle = "Advanced Materials Research",

}

TY - GEN

T1 - Investigation of simple process technology for the fabrication of valveless micropumps

AU - Yunas, Jumril

AU - Johari, Juliana

AU - Bahadorimehr, A. R.

AU - Gebeshuber, I. C.

AU - Yeop Majlis, Burhanuddin

PY - 2011

Y1 - 2011

N2 - This paper presents a simple process technique for the fabrication of valveless micropumps. The process design utilizes standard MEMS process using double-sided anisotropic silicon wet etching process with an additional adhesive bonding technique. The diffuser and nozzle element of the pump with depth of 50 μm, as well as a 150 μm thick silicon membrane are designed and fabricated using only 3 patterning process steps. A piezoelectric plate working at the frequency range from 0.1 kHz to 2 kHz is bonded on to the back side of the silicon membrane to create the membrane actuation. The patterning process of thick photoresist used as the adhesive layer for the substrate bonding is also discussed in detail. The fluid flow is observed and the process reproducibility is proven which show a good prospect for the future development of miniaturized valveless pump for biomedical application.

AB - This paper presents a simple process technique for the fabrication of valveless micropumps. The process design utilizes standard MEMS process using double-sided anisotropic silicon wet etching process with an additional adhesive bonding technique. The diffuser and nozzle element of the pump with depth of 50 μm, as well as a 150 μm thick silicon membrane are designed and fabricated using only 3 patterning process steps. A piezoelectric plate working at the frequency range from 0.1 kHz to 2 kHz is bonded on to the back side of the silicon membrane to create the membrane actuation. The patterning process of thick photoresist used as the adhesive layer for the substrate bonding is also discussed in detail. The fluid flow is observed and the process reproducibility is proven which show a good prospect for the future development of miniaturized valveless pump for biomedical application.

KW - Adhesive bonding

KW - MEMS

KW - Valveless micropump

KW - Wet etching

UR - http://www.scopus.com/inward/record.url?scp=79960063531&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79960063531&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/AMR.254.211

DO - 10.4028/www.scientific.net/AMR.254.211

M3 - Conference contribution

SN - 9783037851456

VL - 254

T3 - Advanced Materials Research

SP - 211

EP - 214

BT - Advanced Materials Research

ER -