Investigation of corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni solder paste alloys in simulated body fluid (SBF)

C. Sarveswaran, Emee Marina Salleh, Azman Jalar @ Jalil, Z. Samsudin, M. Yusuf Tura Ali, F. Che Ani, Norinsan Kamil Othman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The electrochemical migration (ECM) behaviour of SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni has been investigated by using simulated body fluid (SBF) solution. Water drop test (WDT) was performed to compute the mean-time-to-failure (MTTF) of each sample while its electrical behaviour was examined using four-point probe test station. The microstructure of each solder paste alloy was observed using field emission scanning electron microscope (FESEM) with energy dispersive X-ray spectroscopy (EDX) to analyse the elemental composition of the solder alloy. The MTTF result shows that SAC 305 has the fastest time-to-failure (TTF) due to short circuit. The corrosion susceptibility of SAC 305 was higher compared with SAC 0307-0.03P-0.005Ni. This was because of the influence of dopant phosphorus and nickel incorporation in the SAC 0307-0.03 P-0.005 Ni. The four point-probe test station reveals that SAC 305 is a good electric conductor whilst SAC 0307-0.03 P-0.005 Ni is a poor electric conductor. The rate of dendritic growth was influenced by the alloying element of the solder. Therefore, SAC 0307-0.03 P-0.005 Ni have a good corrosion resistance in SBF medium.

Original languageEnglish
Title of host publication1st UKM-ISESCO-COMSATS International Workshop on Nanotechnology for Young Scientists, IWYS 2016
PublisherAmerican Institute of Physics Inc.
Volume1838
ISBN (Electronic)9780735415089
DOIs
Publication statusPublished - 5 May 2017
Event1st UKM-ISESCO-COMSATS International Workshop on Nanotechnology for Young Scientists, IWYS 2016 - Selangor, Malaysia
Duration: 28 Nov 201630 Nov 2016

Other

Other1st UKM-ISESCO-COMSATS International Workshop on Nanotechnology for Young Scientists, IWYS 2016
CountryMalaysia
CitySelangor
Period28/11/1630/11/16

Fingerprint

body fluids
solders
electric conductors
corrosion
stations
drop tests
probes
short circuits
corrosion resistance
alloying
phosphorus
field emission
electron microscopes
nickel
magnetic permeability
microstructure
scanning
water
spectroscopy
x rays

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Sarveswaran, C., Salleh, E. M., Jalar @ Jalil, A., Samsudin, Z., Ali, M. Y. T., Ani, F. C., & Othman, N. K. (2017). Investigation of corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni solder paste alloys in simulated body fluid (SBF). In 1st UKM-ISESCO-COMSATS International Workshop on Nanotechnology for Young Scientists, IWYS 2016 (Vol. 1838). [020003] American Institute of Physics Inc.. https://doi.org/10.1063/1.4982175

Investigation of corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni solder paste alloys in simulated body fluid (SBF). / Sarveswaran, C.; Salleh, Emee Marina; Jalar @ Jalil, Azman; Samsudin, Z.; Ali, M. Yusuf Tura; Ani, F. Che; Othman, Norinsan Kamil.

1st UKM-ISESCO-COMSATS International Workshop on Nanotechnology for Young Scientists, IWYS 2016. Vol. 1838 American Institute of Physics Inc., 2017. 020003.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sarveswaran, C, Salleh, EM, Jalar @ Jalil, A, Samsudin, Z, Ali, MYT, Ani, FC & Othman, NK 2017, Investigation of corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni solder paste alloys in simulated body fluid (SBF). in 1st UKM-ISESCO-COMSATS International Workshop on Nanotechnology for Young Scientists, IWYS 2016. vol. 1838, 020003, American Institute of Physics Inc., 1st UKM-ISESCO-COMSATS International Workshop on Nanotechnology for Young Scientists, IWYS 2016, Selangor, Malaysia, 28/11/16. https://doi.org/10.1063/1.4982175
Sarveswaran C, Salleh EM, Jalar @ Jalil A, Samsudin Z, Ali MYT, Ani FC et al. Investigation of corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni solder paste alloys in simulated body fluid (SBF). In 1st UKM-ISESCO-COMSATS International Workshop on Nanotechnology for Young Scientists, IWYS 2016. Vol. 1838. American Institute of Physics Inc. 2017. 020003 https://doi.org/10.1063/1.4982175
Sarveswaran, C. ; Salleh, Emee Marina ; Jalar @ Jalil, Azman ; Samsudin, Z. ; Ali, M. Yusuf Tura ; Ani, F. Che ; Othman, Norinsan Kamil. / Investigation of corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni solder paste alloys in simulated body fluid (SBF). 1st UKM-ISESCO-COMSATS International Workshop on Nanotechnology for Young Scientists, IWYS 2016. Vol. 1838 American Institute of Physics Inc., 2017.
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abstract = "The electrochemical migration (ECM) behaviour of SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni has been investigated by using simulated body fluid (SBF) solution. Water drop test (WDT) was performed to compute the mean-time-to-failure (MTTF) of each sample while its electrical behaviour was examined using four-point probe test station. The microstructure of each solder paste alloy was observed using field emission scanning electron microscope (FESEM) with energy dispersive X-ray spectroscopy (EDX) to analyse the elemental composition of the solder alloy. The MTTF result shows that SAC 305 has the fastest time-to-failure (TTF) due to short circuit. The corrosion susceptibility of SAC 305 was higher compared with SAC 0307-0.03P-0.005Ni. This was because of the influence of dopant phosphorus and nickel incorporation in the SAC 0307-0.03 P-0.005 Ni. The four point-probe test station reveals that SAC 305 is a good electric conductor whilst SAC 0307-0.03 P-0.005 Ni is a poor electric conductor. The rate of dendritic growth was influenced by the alloying element of the solder. Therefore, SAC 0307-0.03 P-0.005 Ni have a good corrosion resistance in SBF medium.",
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AU - Salleh, Emee Marina

AU - Jalar @ Jalil, Azman

AU - Samsudin, Z.

AU - Ali, M. Yusuf Tura

AU - Ani, F. Che

AU - Othman, Norinsan Kamil

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AB - The electrochemical migration (ECM) behaviour of SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni has been investigated by using simulated body fluid (SBF) solution. Water drop test (WDT) was performed to compute the mean-time-to-failure (MTTF) of each sample while its electrical behaviour was examined using four-point probe test station. The microstructure of each solder paste alloy was observed using field emission scanning electron microscope (FESEM) with energy dispersive X-ray spectroscopy (EDX) to analyse the elemental composition of the solder alloy. The MTTF result shows that SAC 305 has the fastest time-to-failure (TTF) due to short circuit. The corrosion susceptibility of SAC 305 was higher compared with SAC 0307-0.03P-0.005Ni. This was because of the influence of dopant phosphorus and nickel incorporation in the SAC 0307-0.03 P-0.005 Ni. The four point-probe test station reveals that SAC 305 is a good electric conductor whilst SAC 0307-0.03 P-0.005 Ni is a poor electric conductor. The rate of dendritic growth was influenced by the alloying element of the solder. Therefore, SAC 0307-0.03 P-0.005 Ni have a good corrosion resistance in SBF medium.

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