Interfacial TEM Analysis of Sintered Silver in Air and N2-5%H2 Gases Environment

Kim Shyong Siow, Siang T. Chua, Zuruzi A. Samah

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Sintered silver (Ag) is being used as a Pb-free die-attach material for selected high-temperature application. Reliable sintered Ag joint depends on sintering pressure, time, temperature, paste formulation, bonding area and environment to achieve the desired density and bonding to the substrates. Interfacial region determines the bonding strength as much as the densification of the sintered Ag joint. Air atmosphere sintering of micron-Ag paste oxidized the Cu substrate to prevent any inter-diffusion of Ag atoms which were observable under HR-TEM. Yet, these copper oxides acted as adhesive to produce higher die shear strength than those sintered in the forming gas (N2-5%H2). The N2-5%H2 environment assisted the densification and sintering of micron-Ag to the pristine Cu substrate; increasing the bonding quality and die-shear strength, compared to the total absence of bonding for the micron-Ag paste sintered in N2 environment. This result highlights the importance of using high resolution TEM to understand the strengthening mechanism of micron-Ag joints at Cu substrates in air and forming (N2-5%H2) gases environment.

Original languageEnglish
Title of host publication2018 IEEE 38th International Electronics Manufacturing Technology Conference, IEMT 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538662113
DOIs
Publication statusPublished - 26 Oct 2018
Event38th IEEE International Electronics Manufacturing Technology Conference, IEMT 2018 - Melaka, Malaysia
Duration: 4 Sep 20186 Sep 2018

Other

Other38th IEEE International Electronics Manufacturing Technology Conference, IEMT 2018
CountryMalaysia
CityMelaka
Period4/9/186/9/18

Fingerprint

Silver
Gases
Transmission electron microscopy
Ointments
Air
Adhesive pastes
Sintering
Substrates
Densification
Shear strength
High temperature applications
Copper oxides
Adhesives
Atoms
Temperature

Keywords

  • copper
  • die attach materials
  • low-temperature joining technique
  • Pb-free
  • sintered silver

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

Cite this

Siow, K. S., Chua, S. T., & Samah, Z. A. (2018). Interfacial TEM Analysis of Sintered Silver in Air and N2-5%H2 Gases Environment. In 2018 IEEE 38th International Electronics Manufacturing Technology Conference, IEMT 2018 [8511681] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEMT.2018.8511681

Interfacial TEM Analysis of Sintered Silver in Air and N2-5%H2 Gases Environment. / Siow, Kim Shyong; Chua, Siang T.; Samah, Zuruzi A.

2018 IEEE 38th International Electronics Manufacturing Technology Conference, IEMT 2018. Institute of Electrical and Electronics Engineers Inc., 2018. 8511681.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Siow, KS, Chua, ST & Samah, ZA 2018, Interfacial TEM Analysis of Sintered Silver in Air and N2-5%H2 Gases Environment. in 2018 IEEE 38th International Electronics Manufacturing Technology Conference, IEMT 2018., 8511681, Institute of Electrical and Electronics Engineers Inc., 38th IEEE International Electronics Manufacturing Technology Conference, IEMT 2018, Melaka, Malaysia, 4/9/18. https://doi.org/10.1109/IEMT.2018.8511681
Siow KS, Chua ST, Samah ZA. Interfacial TEM Analysis of Sintered Silver in Air and N2-5%H2 Gases Environment. In 2018 IEEE 38th International Electronics Manufacturing Technology Conference, IEMT 2018. Institute of Electrical and Electronics Engineers Inc. 2018. 8511681 https://doi.org/10.1109/IEMT.2018.8511681
Siow, Kim Shyong ; Chua, Siang T. ; Samah, Zuruzi A. / Interfacial TEM Analysis of Sintered Silver in Air and N2-5%H2 Gases Environment. 2018 IEEE 38th International Electronics Manufacturing Technology Conference, IEMT 2018. Institute of Electrical and Electronics Engineers Inc., 2018.
@inproceedings{0c8cb2d83cec4bef817057891d432c1c,
title = "Interfacial TEM Analysis of Sintered Silver in Air and N2-5{\%}H2 Gases Environment",
abstract = "Sintered silver (Ag) is being used as a Pb-free die-attach material for selected high-temperature application. Reliable sintered Ag joint depends on sintering pressure, time, temperature, paste formulation, bonding area and environment to achieve the desired density and bonding to the substrates. Interfacial region determines the bonding strength as much as the densification of the sintered Ag joint. Air atmosphere sintering of micron-Ag paste oxidized the Cu substrate to prevent any inter-diffusion of Ag atoms which were observable under HR-TEM. Yet, these copper oxides acted as adhesive to produce higher die shear strength than those sintered in the forming gas (N2-5{\%}H2). The N2-5{\%}H2 environment assisted the densification and sintering of micron-Ag to the pristine Cu substrate; increasing the bonding quality and die-shear strength, compared to the total absence of bonding for the micron-Ag paste sintered in N2 environment. This result highlights the importance of using high resolution TEM to understand the strengthening mechanism of micron-Ag joints at Cu substrates in air and forming (N2-5{\%}H2) gases environment.",
keywords = "copper, die attach materials, low-temperature joining technique, Pb-free, sintered silver",
author = "Siow, {Kim Shyong} and Chua, {Siang T.} and Samah, {Zuruzi A.}",
year = "2018",
month = "10",
day = "26",
doi = "10.1109/IEMT.2018.8511681",
language = "English",
booktitle = "2018 IEEE 38th International Electronics Manufacturing Technology Conference, IEMT 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",

}

TY - GEN

T1 - Interfacial TEM Analysis of Sintered Silver in Air and N2-5%H2 Gases Environment

AU - Siow, Kim Shyong

AU - Chua, Siang T.

AU - Samah, Zuruzi A.

PY - 2018/10/26

Y1 - 2018/10/26

N2 - Sintered silver (Ag) is being used as a Pb-free die-attach material for selected high-temperature application. Reliable sintered Ag joint depends on sintering pressure, time, temperature, paste formulation, bonding area and environment to achieve the desired density and bonding to the substrates. Interfacial region determines the bonding strength as much as the densification of the sintered Ag joint. Air atmosphere sintering of micron-Ag paste oxidized the Cu substrate to prevent any inter-diffusion of Ag atoms which were observable under HR-TEM. Yet, these copper oxides acted as adhesive to produce higher die shear strength than those sintered in the forming gas (N2-5%H2). The N2-5%H2 environment assisted the densification and sintering of micron-Ag to the pristine Cu substrate; increasing the bonding quality and die-shear strength, compared to the total absence of bonding for the micron-Ag paste sintered in N2 environment. This result highlights the importance of using high resolution TEM to understand the strengthening mechanism of micron-Ag joints at Cu substrates in air and forming (N2-5%H2) gases environment.

AB - Sintered silver (Ag) is being used as a Pb-free die-attach material for selected high-temperature application. Reliable sintered Ag joint depends on sintering pressure, time, temperature, paste formulation, bonding area and environment to achieve the desired density and bonding to the substrates. Interfacial region determines the bonding strength as much as the densification of the sintered Ag joint. Air atmosphere sintering of micron-Ag paste oxidized the Cu substrate to prevent any inter-diffusion of Ag atoms which were observable under HR-TEM. Yet, these copper oxides acted as adhesive to produce higher die shear strength than those sintered in the forming gas (N2-5%H2). The N2-5%H2 environment assisted the densification and sintering of micron-Ag to the pristine Cu substrate; increasing the bonding quality and die-shear strength, compared to the total absence of bonding for the micron-Ag paste sintered in N2 environment. This result highlights the importance of using high resolution TEM to understand the strengthening mechanism of micron-Ag joints at Cu substrates in air and forming (N2-5%H2) gases environment.

KW - copper

KW - die attach materials

KW - low-temperature joining technique

KW - Pb-free

KW - sintered silver

UR - http://www.scopus.com/inward/record.url?scp=85057078928&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85057078928&partnerID=8YFLogxK

U2 - 10.1109/IEMT.2018.8511681

DO - 10.1109/IEMT.2018.8511681

M3 - Conference contribution

BT - 2018 IEEE 38th International Electronics Manufacturing Technology Conference, IEMT 2018

PB - Institute of Electrical and Electronics Engineers Inc.

ER -