Influence of sintering environment on silver sintered on copper substrate

Kim Shyong Siow, S. T. Chua, B. D. Beake, A. S. Zuruzi

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Sintered silver joint has been reported as the front-runner for Pb-free die attach joints for high temperature applications. In this study, micron-Ag and nano-Ag paste were sintered in either air or nitrogen (N 2 ) atmosphere. While sintered silver joints have excellent mechanical properties, their performance depends on density and porosity which in turn are dependent on sintering environment. In this study, micron-Ag and nano-Ag paste were sintered in either air or N 2 gas environment. Micron-Ag joint failed to sinter in N 2 atmosphere but registered die shear strength of 13 MPa when sintered in air despite thick Cu oxides at the Cu-sintered micron-Ag interfaces. Sintering nano-Ag in air promoted an inter-diffused region of Ag–Cu (200 nm) at the Cu-substrate with nano-cracks visible under transmission electron microscope. This nano-cracks reduced the die-shear strength in spite of the finer grain-size found in air-sintered nano-Ag joint. In addition, a nano-indentation method based on “constant-load” was used to differentiate the creep mechanism and elastic-properties of sintered Ag joints produced in air and N 2 gas from those of Sn-3.5Ag solder. This simplified approach confirmed the familiar relationship between density and creep resistance observed in other sintered materials; low density sintered Ag was less resistant to creep failure and had a lower elastic modulus than the high density sintered Ag joint.

Original languageEnglish
JournalJournal of Materials Science: Materials in Electronics
DOIs
Publication statusPublished - 1 Jan 2019

Fingerprint

Silver
Copper
sintering
Sintering
silver
copper
air
Substrates
Air
shear strength
Ointments
Shear strength
Creep
cracks
Gases
Cracks
atmospheres
creep strength
Creep resistance
High temperature applications

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Influence of sintering environment on silver sintered on copper substrate. / Siow, Kim Shyong; Chua, S. T.; Beake, B. D.; Zuruzi, A. S.

In: Journal of Materials Science: Materials in Electronics, 01.01.2019.

Research output: Contribution to journalArticle

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