Influence of printed circuit board thickness in wave soldering

M. S.A. Aziz, M. Z. Abdullah, C. Y. Khorc, I. A. Azid, Azman Jalar @ Jalil, F. C. Che Ani

Research output: Contribution to journalArticle

Abstract

This paper presents a thermal Fluid-Structure Interaction (FSI) study of Printed Circuito Bards (PCBs) during wave soldering. The inuences of PCB thickness on displacement, stress, and temperature distribution are the foci of this study. Five PCB thicknesses (i.e., 0.6, 1.0, 1.6, 2.4, and 3.1 mm) are considered. The paper focuses on a simple PCB with a single hole and is constructed in a three-dimensional model. The thermal FSI of the PCB is solved by fluid (FLUENT) and structure (ABAQUS) solvers that are connected using the mesh-based parallel code coupling interface method. Molten solder advancement is tracked using volume-of-fluid technique in the thermal fluid analysis. ABAQUS solves PCB displacement, von Mises stress, and temperature distributions when high solder temperature is encountered during wave soldering. The correlations of PCB thickness with displacement, von Mises stress, temperature distribution, and molten solder filling time are studied. Results reveal that an increase in PCB thickness yields a linear correlation with solder filling time. Temperature distribution, von Mises stress, and displacement of PCB exhibit polynomial behavior to PCB thickness. A laboratory-scale two-way wave-soldering machine is also used to measure PCB temperature during wave soldering. The predicted temperature of PCB is substantiated by the experimental results.

Original languageEnglish
Pages (from-to)2963-2976
Number of pages14
JournalScientia Iranica
Volume24
Issue number6
DOIs
Publication statusPublished - 1 Nov 2017

Fingerprint

Soldering
Printed circuit boards
Soldering alloys
Temperature distribution
Fluid structure interaction
ABAQUS
Fluids
Molten materials
Stress concentration
Temperature
Polynomials
Hot Temperature

Keywords

  • Displacement
  • Printed Circuit Board (PCB)
  • Thermal stress
  • Thermal uidstructure interaction
  • Wave soldering

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Aziz, M. S. A., Abdullah, M. Z., Khorc, C. Y., Azid, I. A., Jalar @ Jalil, A., & Che Ani, F. C. (2017). Influence of printed circuit board thickness in wave soldering. Scientia Iranica, 24(6), 2963-2976. https://doi.org/10.24200/sci.2017.4311

Influence of printed circuit board thickness in wave soldering. / Aziz, M. S.A.; Abdullah, M. Z.; Khorc, C. Y.; Azid, I. A.; Jalar @ Jalil, Azman; Che Ani, F. C.

In: Scientia Iranica, Vol. 24, No. 6, 01.11.2017, p. 2963-2976.

Research output: Contribution to journalArticle

Aziz, MSA, Abdullah, MZ, Khorc, CY, Azid, IA, Jalar @ Jalil, A & Che Ani, FC 2017, 'Influence of printed circuit board thickness in wave soldering', Scientia Iranica, vol. 24, no. 6, pp. 2963-2976. https://doi.org/10.24200/sci.2017.4311
Aziz, M. S.A. ; Abdullah, M. Z. ; Khorc, C. Y. ; Azid, I. A. ; Jalar @ Jalil, Azman ; Che Ani, F. C. / Influence of printed circuit board thickness in wave soldering. In: Scientia Iranica. 2017 ; Vol. 24, No. 6. pp. 2963-2976.
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