Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump

Nowshad Amin, Ang Ye Cheah, Lam Zi Yi, Zainudin Kornain

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Various reflow profiles have been applied on different no-clean fluxes amount in removing the oxide layer of high lead solder bump. The wafers exposed to open air induce an oxide layer on the high lead solder bump. This oxide layer eventually creates the non wet phenomena in flip chip packaging. An experimental study is carried out by varying different soak time of the reflow profile to optimize the effectiveness of the flux in solving the eutectic and controlled collapse chip connection (C4) high lead bump issue, which indirectly solves the non wet issue. Visual inspection on high lead solder bump under high power microscope is carried out after reflow process. Die pull test is carried out on the solder joint strength analysis to test the solder bump strength. Besides, experiments on substrate cleanliness test, nonwet phenomena and die misalignment are also conducted with useful hints to be implemented.

Original languageEnglish
Title of host publicationProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
DOIs
Publication statusPublished - 2008
Event2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008 - Penang, Malaysia
Duration: 4 Nov 20086 Nov 2008

Other

Other2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008
CountryMalaysia
CityPenang
Period4/11/086/11/08

Fingerprint

Soldering alloys
Lead
Fluxes
Oxides
Eutectics
Packaging
Microscopes
Inspection
Substrates
Air
Experiments

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Amin, N., Cheah, A. Y., Yi, L. Z., & Kornain, Z. (2008). Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium [5507833] https://doi.org/10.1109/IEMT.2008.5507833

Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump. / Amin, Nowshad; Cheah, Ang Ye; Yi, Lam Zi; Kornain, Zainudin.

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008. 5507833.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Amin, N, Cheah, AY, Yi, LZ & Kornain, Z 2008, Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump. in Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium., 5507833, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008, Penang, Malaysia, 4/11/08. https://doi.org/10.1109/IEMT.2008.5507833
Amin N, Cheah AY, Yi LZ, Kornain Z. Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008. 5507833 https://doi.org/10.1109/IEMT.2008.5507833
Amin, Nowshad ; Cheah, Ang Ye ; Yi, Lam Zi ; Kornain, Zainudin. / Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008.
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