Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Kim Shyong Siow, Y. T. Lin

Research output: Contribution to journalArticle

36 Citations (Scopus)

Abstract

Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill the operating conditions of wide band-gap (WBG) power device technologies. We review the current technology development of sintered Ag as a bonding material from the perspective of patents filed by various stakeholders since late 1980s. This review addresses the formulation of sintered pastes (i.e., nano-Ag, hybrid Ag, and micron Ag fillers), innovations in the process and equipment to form this Ag joint. This review will provide the insights and confidence to engineers, scientists from universities and industry as well as investors who are developing and commercializing the sintered Ag as a bonding material for microelectronic packaging.

Original languageEnglish
Article number020804
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume138
Issue number2
DOIs
Publication statusPublished - 1 Jun 2016

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Silver
Microelectronics
Packaging
Ointments
Fillers
Energy gap
Innovation
Semiconductor materials
Engineers
Substrates
Industry

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Computer Science Applications
  • Mechanics of Materials

Cite this

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