High-temperature Pb-free die attach material project phase 1

Survey result

Lim Sze Pei, Binghua Pan, Hongwen Zhang, Wayne Ng, Bosgum Wu, Kim Shyong Siow, Sayalee Sabne, Masahiro Tsuriya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

High-Pb solders have been used as die-attach and interconnect materials since long time for discrete power packages, including MOSFET, smart power ASICs, IGBT modules and integrated power modules, operating under high-power and high-current operation environments. Due to the known harmful effects of Pb to human health and the environment, alternative Pb-free solders and other Pb-free solutions have been studied for decades. But, Pb-free alternatives to replace high-lead solders are still in the infant age and no recognized drop-in solution is available yet. The exemption of using high-Pb solders has been extended again to 2021. iNEMI initiated a project and conducted an industry-wide survey to benchmark the availability of Pb-free die bonding materials, the technological feasibility for the same and the ongoing industrial trend. Based on the survey results, this paper presents the insights on the industrial preferences and the potential lead-free materials.

Original languageEnglish
Title of host publication2017 International Conference on Electronics Packaging, ICEP 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages51-56
Number of pages6
ISBN (Electronic)9784990218836
DOIs
Publication statusPublished - 5 Jun 2017
Event2017 International Conference on Electronics Packaging, ICEP 2017 - Tendo, Yamagata, Japan
Duration: 19 Apr 201722 Apr 2017

Other

Other2017 International Conference on Electronics Packaging, ICEP 2017
CountryJapan
CityTendo, Yamagata
Period19/4/1722/4/17

Fingerprint

Soldering alloys
Lead
Insulated gate bipolar transistors (IGBT)
Application specific integrated circuits
Temperature
Health
Availability
Industry
Lead-free solders

Keywords

  • Ag and Cu sintering materials
  • conductive adhesive
  • die-attach
  • Pb-free solder
  • transient liquid phase bonding material

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Pei, L. S., Pan, B., Zhang, H., Ng, W., Wu, B., Siow, K. S., ... Tsuriya, M. (2017). High-temperature Pb-free die attach material project phase 1: Survey result. In 2017 International Conference on Electronics Packaging, ICEP 2017 (pp. 51-56). [7939323] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2017.7939323

High-temperature Pb-free die attach material project phase 1 : Survey result. / Pei, Lim Sze; Pan, Binghua; Zhang, Hongwen; Ng, Wayne; Wu, Bosgum; Siow, Kim Shyong; Sabne, Sayalee; Tsuriya, Masahiro.

2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 51-56 7939323.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Pei, LS, Pan, B, Zhang, H, Ng, W, Wu, B, Siow, KS, Sabne, S & Tsuriya, M 2017, High-temperature Pb-free die attach material project phase 1: Survey result. in 2017 International Conference on Electronics Packaging, ICEP 2017., 7939323, Institute of Electrical and Electronics Engineers Inc., pp. 51-56, 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Yamagata, Japan, 19/4/17. https://doi.org/10.23919/ICEP.2017.7939323
Pei LS, Pan B, Zhang H, Ng W, Wu B, Siow KS et al. High-temperature Pb-free die attach material project phase 1: Survey result. In 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 51-56. 7939323 https://doi.org/10.23919/ICEP.2017.7939323
Pei, Lim Sze ; Pan, Binghua ; Zhang, Hongwen ; Ng, Wayne ; Wu, Bosgum ; Siow, Kim Shyong ; Sabne, Sayalee ; Tsuriya, Masahiro. / High-temperature Pb-free die attach material project phase 1 : Survey result. 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 51-56
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