High reliability of MEMS packaged capacitive pressure sensor employing 3C-SiC for high temperature

Noraini Marsi, Burhanuddin Yeop Majlis, Azrul Azlan Hamzah, Faisal Mohd-Yasin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

18 Citations (Scopus)

Abstract

This study develops the prototype of a micro-electro-mechanical systems (MEMS) packaged capacitive pressure sensor employing 3C-SiC diaphragm for high temperature devices. The 3C-SiC diaphragm is designed with the thicknesses of 1.0 μm and the width and length of 2.0 mm x 2.0 mm. The fabricated sensor is combined with a reliable stainless steel o-ring packaging concept as a simple assembly approach to reduce the manufacturing cost. There is an o-ring seal at the sensor devices an advantageous for high reliability, small size, lightweight, smart interface features and easy maintenance services. The stability and performance of the prototype devices has been tested for three test group and measured by using LCR meter. The prototypes of MEMS capacitive pressure sensor are characterized under static pressure of 5.0 MPa and temperatures up to 500C in a stainless steel chamber with direct capacitance measurement. At room temperature (27C), the sensitivity of the sensor is 0.0096 pF/MPa in the range of pressure (1.0 - 5.0 MPa), with nonlinearity of 0.49%. At 300C, the sensitivity is 0.0127 pF/MPa, and the nonlinearity of 0.46%. The sensitivity increased by 0.0031 pF/MPa; corresponding temperature coefficient of sensitivity is 0.058%/C. At 500C, the maximum temperature coefficient of output change is 0.073%/C being measured at 5.0 MPa. The main impact of this work is the ability of the sensor to operate up to 500C, compare to the previous work using similar 3C-SiC diaphragm that can operates only 300C. The results also show that MEMS packaged capacitive pressure sensor employing 3CSiC is performed high reliability for high temperature up to 500C. In addition, a reliable stainless steel o-ring packaging concept of MEMS packaged capacitive pressure sensor.

Original languageEnglish
Title of host publication2nd International Conference on Sustainable Energy Engineering and Application: Sustainable Energy for Green Mobility, ICSEEA 2014
PublisherElsevier Ltd
Pages471-479
Number of pages9
Volume68
DOIs
Publication statusPublished - 1 Apr 2015
Event2nd International Conference on Sustainable Energy Engineering and Application, ICSEEA 2014 - Bandung, Indonesia
Duration: 14 Oct 201416 Oct 2014

Other

Other2nd International Conference on Sustainable Energy Engineering and Application, ICSEEA 2014
CountryIndonesia
CityBandung
Period14/10/1416/10/14

Fingerprint

Capacitive sensors
Pressure sensors
Diaphragms
Stainless steel
Sensors
Temperature
Packaging
Capacitance measurement
Seals
Costs

Keywords

  • 3C-SiC
  • Capacitance
  • Capacitive
  • MEMS
  • O-ring
  • Sensitivity

ASJC Scopus subject areas

  • Energy(all)

Cite this

Marsi, N., Yeop Majlis, B., Hamzah, A. A., & Mohd-Yasin, F. (2015). High reliability of MEMS packaged capacitive pressure sensor employing 3C-SiC for high temperature. In 2nd International Conference on Sustainable Energy Engineering and Application: Sustainable Energy for Green Mobility, ICSEEA 2014 (Vol. 68, pp. 471-479). Elsevier Ltd. https://doi.org/10.1016/j.egypro.2015.03.279

High reliability of MEMS packaged capacitive pressure sensor employing 3C-SiC for high temperature. / Marsi, Noraini; Yeop Majlis, Burhanuddin; Hamzah, Azrul Azlan; Mohd-Yasin, Faisal.

2nd International Conference on Sustainable Energy Engineering and Application: Sustainable Energy for Green Mobility, ICSEEA 2014. Vol. 68 Elsevier Ltd, 2015. p. 471-479.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Marsi, N, Yeop Majlis, B, Hamzah, AA & Mohd-Yasin, F 2015, High reliability of MEMS packaged capacitive pressure sensor employing 3C-SiC for high temperature. in 2nd International Conference on Sustainable Energy Engineering and Application: Sustainable Energy for Green Mobility, ICSEEA 2014. vol. 68, Elsevier Ltd, pp. 471-479, 2nd International Conference on Sustainable Energy Engineering and Application, ICSEEA 2014, Bandung, Indonesia, 14/10/14. https://doi.org/10.1016/j.egypro.2015.03.279
Marsi N, Yeop Majlis B, Hamzah AA, Mohd-Yasin F. High reliability of MEMS packaged capacitive pressure sensor employing 3C-SiC for high temperature. In 2nd International Conference on Sustainable Energy Engineering and Application: Sustainable Energy for Green Mobility, ICSEEA 2014. Vol. 68. Elsevier Ltd. 2015. p. 471-479 https://doi.org/10.1016/j.egypro.2015.03.279
Marsi, Noraini ; Yeop Majlis, Burhanuddin ; Hamzah, Azrul Azlan ; Mohd-Yasin, Faisal. / High reliability of MEMS packaged capacitive pressure sensor employing 3C-SiC for high temperature. 2nd International Conference on Sustainable Energy Engineering and Application: Sustainable Energy for Green Mobility, ICSEEA 2014. Vol. 68 Elsevier Ltd, 2015. pp. 471-479
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abstract = "This study develops the prototype of a micro-electro-mechanical systems (MEMS) packaged capacitive pressure sensor employing 3C-SiC diaphragm for high temperature devices. The 3C-SiC diaphragm is designed with the thicknesses of 1.0 μm and the width and length of 2.0 mm x 2.0 mm. The fabricated sensor is combined with a reliable stainless steel o-ring packaging concept as a simple assembly approach to reduce the manufacturing cost. There is an o-ring seal at the sensor devices an advantageous for high reliability, small size, lightweight, smart interface features and easy maintenance services. The stability and performance of the prototype devices has been tested for three test group and measured by using LCR meter. The prototypes of MEMS capacitive pressure sensor are characterized under static pressure of 5.0 MPa and temperatures up to 500C in a stainless steel chamber with direct capacitance measurement. At room temperature (27C), the sensitivity of the sensor is 0.0096 pF/MPa in the range of pressure (1.0 - 5.0 MPa), with nonlinearity of 0.49{\%}. At 300C, the sensitivity is 0.0127 pF/MPa, and the nonlinearity of 0.46{\%}. The sensitivity increased by 0.0031 pF/MPa; corresponding temperature coefficient of sensitivity is 0.058{\%}/C. At 500C, the maximum temperature coefficient of output change is 0.073{\%}/C being measured at 5.0 MPa. The main impact of this work is the ability of the sensor to operate up to 500C, compare to the previous work using similar 3C-SiC diaphragm that can operates only 300C. The results also show that MEMS packaged capacitive pressure sensor employing 3CSiC is performed high reliability for high temperature up to 500C. In addition, a reliable stainless steel o-ring packaging concept of MEMS packaged capacitive pressure sensor.",
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