High efficiency 850 nm vertical-cavity surface-emitting laser using fan-pad metallization and trench patterning

Mohd Sharizal Alias, Paul O. Leisher, Kent D. Choquette, Sahbuddin Shaari

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    In this paper, fan-pad metallization and trench patterning were introduced in 850 nm Vertical-Cavity Surface-Emitting Laser (VCSEL) device packaging. Low threshold current and series resistance, which contributes to higher VCSEL efficiency, are obtained for the VCSEL with fan-metallization and trench patterning fabricated devices. Further, the output spectral characteristics show stable multimode operation for these devices. The results indicate that the proposed VCSEL packaging exhibits superior device performance compared to typical packaged VCSEL with square-pad metal.

    Original languageEnglish
    Title of host publicationProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
    DOIs
    Publication statusPublished - 2008
    Event2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008 - Penang, Malaysia
    Duration: 4 Nov 20086 Nov 2008

    Other

    Other2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008
    CountryMalaysia
    CityPenang
    Period4/11/086/11/08

    Fingerprint

    Surface emitting lasers
    Metallizing
    Fans
    Packaging
    Metals

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Industrial and Manufacturing Engineering

    Cite this

    Alias, M. S., Leisher, P. O., Choquette, K. D., & Shaari, S. (2008). High efficiency 850 nm vertical-cavity surface-emitting laser using fan-pad metallization and trench patterning. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium [5507777] https://doi.org/10.1109/IEMT.2008.5507777

    High efficiency 850 nm vertical-cavity surface-emitting laser using fan-pad metallization and trench patterning. / Alias, Mohd Sharizal; Leisher, Paul O.; Choquette, Kent D.; Shaari, Sahbuddin.

    Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008. 5507777.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Alias, MS, Leisher, PO, Choquette, KD & Shaari, S 2008, High efficiency 850 nm vertical-cavity surface-emitting laser using fan-pad metallization and trench patterning. in Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium., 5507777, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008, Penang, Malaysia, 4/11/08. https://doi.org/10.1109/IEMT.2008.5507777
    Alias MS, Leisher PO, Choquette KD, Shaari S. High efficiency 850 nm vertical-cavity surface-emitting laser using fan-pad metallization and trench patterning. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008. 5507777 https://doi.org/10.1109/IEMT.2008.5507777
    Alias, Mohd Sharizal ; Leisher, Paul O. ; Choquette, Kent D. ; Shaari, Sahbuddin. / High efficiency 850 nm vertical-cavity surface-emitting laser using fan-pad metallization and trench patterning. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008.
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