Hardness variation of ball bond wire bonding

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In semiconductor packaging, conventional test procedures for evaluating mechanical properties of ball bonded gold wire bonding are well established. However these tests do not provide clear understanding related to the strength mechanism leading to improper reliability data. The nanoindentation approach, uses equipment called nanoindenter, gives advances mechanical (sub-micromechanical) characterization, particularly the combination effect of elastic and plastic deformation. Wire bonding process was prepared using thermosonic-wire bonding technology with 25m diameter gold wire and copper as substrate. To obtain mechanical properties, ball-bonded was cross-sectioned diagonally before indented at various locations. Results show that mechanical properties vary according the locations throughout the surface; at the centre, at the edge and at the area near intermetallics layer. This indicates test location plays important role in determining 'meaningful' mechanical properties.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages1048-1051
Number of pages4
Volume399-401
DOIs
Publication statusPublished - 2012
Event2011 International Conference on Chemical, Material and Metallurgical Engineering, ICCMME 2011 - Beihai
Duration: 23 Dec 201125 Dec 2011

Publication series

NameAdvanced Materials Research
Volume399-401
ISSN (Print)10226680

Other

Other2011 International Conference on Chemical, Material and Metallurgical Engineering, ICCMME 2011
CityBeihai
Period23/12/1125/12/11

Fingerprint

Hardness
Wire
Gold
Elastic deformation
Nanoindentation
Intermetallics
Plastic deformation
Packaging
Semiconductor materials
Copper
Substrates

Keywords

  • Hardness
  • Nanoindenter
  • Reduced modulus
  • Wire bonding

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Zulkifli, M. N., Jalar @ Jalil, A., Abdullah, S., Shamsudin, R., & Zulkifli, R. (2012). Hardness variation of ball bond wire bonding. In Advanced Materials Research (Vol. 399-401, pp. 1048-1051). (Advanced Materials Research; Vol. 399-401). https://doi.org/10.4028/www.scientific.net/AMR.399-401.1048

Hardness variation of ball bond wire bonding. / Zulkifli, Muhammd Nubli; Jalar @ Jalil, Azman; Abdullah, Shahrum; Shamsudin, Roslinda; Zulkifli, Rozli.

Advanced Materials Research. Vol. 399-401 2012. p. 1048-1051 (Advanced Materials Research; Vol. 399-401).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zulkifli, MN, Jalar @ Jalil, A, Abdullah, S, Shamsudin, R & Zulkifli, R 2012, Hardness variation of ball bond wire bonding. in Advanced Materials Research. vol. 399-401, Advanced Materials Research, vol. 399-401, pp. 1048-1051, 2011 International Conference on Chemical, Material and Metallurgical Engineering, ICCMME 2011, Beihai, 23/12/11. https://doi.org/10.4028/www.scientific.net/AMR.399-401.1048
Zulkifli MN, Jalar @ Jalil A, Abdullah S, Shamsudin R, Zulkifli R. Hardness variation of ball bond wire bonding. In Advanced Materials Research. Vol. 399-401. 2012. p. 1048-1051. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.399-401.1048
Zulkifli, Muhammd Nubli ; Jalar @ Jalil, Azman ; Abdullah, Shahrum ; Shamsudin, Roslinda ; Zulkifli, Rozli. / Hardness variation of ball bond wire bonding. Advanced Materials Research. Vol. 399-401 2012. pp. 1048-1051 (Advanced Materials Research).
@inproceedings{b23b3401549b43358bc63b859ccb74b0,
title = "Hardness variation of ball bond wire bonding",
abstract = "In semiconductor packaging, conventional test procedures for evaluating mechanical properties of ball bonded gold wire bonding are well established. However these tests do not provide clear understanding related to the strength mechanism leading to improper reliability data. The nanoindentation approach, uses equipment called nanoindenter, gives advances mechanical (sub-micromechanical) characterization, particularly the combination effect of elastic and plastic deformation. Wire bonding process was prepared using thermosonic-wire bonding technology with 25m diameter gold wire and copper as substrate. To obtain mechanical properties, ball-bonded was cross-sectioned diagonally before indented at various locations. Results show that mechanical properties vary according the locations throughout the surface; at the centre, at the edge and at the area near intermetallics layer. This indicates test location plays important role in determining 'meaningful' mechanical properties.",
keywords = "Hardness, Nanoindenter, Reduced modulus, Wire bonding",
author = "Zulkifli, {Muhammd Nubli} and {Jalar @ Jalil}, Azman and Shahrum Abdullah and Roslinda Shamsudin and Rozli Zulkifli",
year = "2012",
doi = "10.4028/www.scientific.net/AMR.399-401.1048",
language = "English",
isbn = "9783037853092",
volume = "399-401",
series = "Advanced Materials Research",
pages = "1048--1051",
booktitle = "Advanced Materials Research",

}

TY - GEN

T1 - Hardness variation of ball bond wire bonding

AU - Zulkifli, Muhammd Nubli

AU - Jalar @ Jalil, Azman

AU - Abdullah, Shahrum

AU - Shamsudin, Roslinda

AU - Zulkifli, Rozli

PY - 2012

Y1 - 2012

N2 - In semiconductor packaging, conventional test procedures for evaluating mechanical properties of ball bonded gold wire bonding are well established. However these tests do not provide clear understanding related to the strength mechanism leading to improper reliability data. The nanoindentation approach, uses equipment called nanoindenter, gives advances mechanical (sub-micromechanical) characterization, particularly the combination effect of elastic and plastic deformation. Wire bonding process was prepared using thermosonic-wire bonding technology with 25m diameter gold wire and copper as substrate. To obtain mechanical properties, ball-bonded was cross-sectioned diagonally before indented at various locations. Results show that mechanical properties vary according the locations throughout the surface; at the centre, at the edge and at the area near intermetallics layer. This indicates test location plays important role in determining 'meaningful' mechanical properties.

AB - In semiconductor packaging, conventional test procedures for evaluating mechanical properties of ball bonded gold wire bonding are well established. However these tests do not provide clear understanding related to the strength mechanism leading to improper reliability data. The nanoindentation approach, uses equipment called nanoindenter, gives advances mechanical (sub-micromechanical) characterization, particularly the combination effect of elastic and plastic deformation. Wire bonding process was prepared using thermosonic-wire bonding technology with 25m diameter gold wire and copper as substrate. To obtain mechanical properties, ball-bonded was cross-sectioned diagonally before indented at various locations. Results show that mechanical properties vary according the locations throughout the surface; at the centre, at the edge and at the area near intermetallics layer. This indicates test location plays important role in determining 'meaningful' mechanical properties.

KW - Hardness

KW - Nanoindenter

KW - Reduced modulus

KW - Wire bonding

UR - http://www.scopus.com/inward/record.url?scp=83755229169&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=83755229169&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/AMR.399-401.1048

DO - 10.4028/www.scientific.net/AMR.399-401.1048

M3 - Conference contribution

SN - 9783037853092

VL - 399-401

T3 - Advanced Materials Research

SP - 1048

EP - 1051

BT - Advanced Materials Research

ER -