Hardness test on an epoxy mold compounds of a Quad Flat No Lead package using the depth sensing nanoindentation

Shahrum Abdullah, M. F M Yunoh, Azman Jalar @ Jalil, M. F. Abdullah

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This study focuses on the effect of stress and load towards hardness at epoxy mold compounds (EMCs) of a Quad Flat No-Lead (QFN) package using indentation technique. A series of three points bending cyclic test were performed with four different loads between 60 N to 120 N on QFN package. The nanoindentation with the maximum load of 300 mN was indented at five locations that perpendicular to the stress line on EMCs of QFN package after three points bending cyclic test were performed. The findings showed that the mean value of hardness was varied with load and stress. Higher load and stress were found to be not affected by hardness of EMCs. From the results, it is believed that the applied load and stress not play a role towards the hardness of EMCs. A polynomial relationship was plotted and shown that correlation of coefficient (R2) between stress and hardness of the studied EMCs was found to be at 97%. Finally, the finding suggested that a close correlation between the stress and hardness since it correlation coefficient gave a higher value with the polynomial relationship.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages1000-1003
Number of pages4
Volume146-147
DOIs
Publication statusPublished - 2011
Event2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010 - Shenzhen
Duration: 6 Nov 20108 Nov 2010

Publication series

NameAdvanced Materials Research
Volume146-147
ISSN (Print)10226680

Other

Other2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010
CityShenzhen
Period6/11/108/11/10

Fingerprint

Nanoindentation
Lead
Hardness
Loads (forces)
Polynomials
Indentation

Keywords

  • Epoxy mold compound (EMCs)
  • Hardness
  • Load
  • Nanoindentation
  • Stress

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Abdullah, S., Yunoh, M. F. M., Jalar @ Jalil, A., & Abdullah, M. F. (2011). Hardness test on an epoxy mold compounds of a Quad Flat No Lead package using the depth sensing nanoindentation. In Advanced Materials Research (Vol. 146-147, pp. 1000-1003). (Advanced Materials Research; Vol. 146-147). https://doi.org/10.4028/www.scientific.net/AMR.146-147.1000

Hardness test on an epoxy mold compounds of a Quad Flat No Lead package using the depth sensing nanoindentation. / Abdullah, Shahrum; Yunoh, M. F M; Jalar @ Jalil, Azman; Abdullah, M. F.

Advanced Materials Research. Vol. 146-147 2011. p. 1000-1003 (Advanced Materials Research; Vol. 146-147).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abdullah, S, Yunoh, MFM, Jalar @ Jalil, A & Abdullah, MF 2011, Hardness test on an epoxy mold compounds of a Quad Flat No Lead package using the depth sensing nanoindentation. in Advanced Materials Research. vol. 146-147, Advanced Materials Research, vol. 146-147, pp. 1000-1003, 2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010, Shenzhen, 6/11/10. https://doi.org/10.4028/www.scientific.net/AMR.146-147.1000
Abdullah, Shahrum ; Yunoh, M. F M ; Jalar @ Jalil, Azman ; Abdullah, M. F. / Hardness test on an epoxy mold compounds of a Quad Flat No Lead package using the depth sensing nanoindentation. Advanced Materials Research. Vol. 146-147 2011. pp. 1000-1003 (Advanced Materials Research).
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