Fracture of a lead-tin and a tin-silver solder under combined tensile shear loading

M. Manoharan, Kim Shyong Siow

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Citation (Scopus)

Abstract

The increasing demands on solder joints have made it imperative that they perform not only their traditional role of electrical connection but also possess good mechanical integrity. One such key mechanical property is the shear strength of the solder. A number of specimen geometries can be used to evaluate the shear strength of solders, each with its advantages and limitations. However, these geometries do not provide information about the notched fracture strength of the solder under shear. Studies on a number of ductile materials have indicated that in many of these materials shear is the preferential mode of fracture even when the imposed load is a combination of tensile and shear. This study, which is part of a larger project on the failure of materials under combined tensile-shear loading, uses a modified compact tension specimen to measure the appropriate failure criterion. It is shown that the fracture of solders under these conditions follows the general principles of a mixed-mode fracture mechanism map and shear is the preferred mode of failure.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium - Proceedings
Pages15-20
Number of pages6
Volume563
Publication statusPublished - 1999
Externally publishedYes

Fingerprint

Tin
Silver
Soldering alloys
Lead
Shear strength
Geometry
Fracture toughness
Mechanical properties

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Manoharan, M., & Siow, K. S. (1999). Fracture of a lead-tin and a tin-silver solder under combined tensile shear loading. In Materials Research Society Symposium - Proceedings (Vol. 563, pp. 15-20)

Fracture of a lead-tin and a tin-silver solder under combined tensile shear loading. / Manoharan, M.; Siow, Kim Shyong.

Materials Research Society Symposium - Proceedings. Vol. 563 1999. p. 15-20.

Research output: Chapter in Book/Report/Conference proceedingChapter

Manoharan, M & Siow, KS 1999, Fracture of a lead-tin and a tin-silver solder under combined tensile shear loading. in Materials Research Society Symposium - Proceedings. vol. 563, pp. 15-20.
Manoharan M, Siow KS. Fracture of a lead-tin and a tin-silver solder under combined tensile shear loading. In Materials Research Society Symposium - Proceedings. Vol. 563. 1999. p. 15-20
Manoharan, M. ; Siow, Kim Shyong. / Fracture of a lead-tin and a tin-silver solder under combined tensile shear loading. Materials Research Society Symposium - Proceedings. Vol. 563 1999. pp. 15-20
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