Fracture behavior of intermetallic compound (IMC) of solder joints based on finite elements’ simulation result

E. P. Ooi, R. Daud, N. A.M. Amin, F. Mat, M. H. Sulaiman, M. S. Abdul Majid, M. Afendi, Ahmad Kamal Ariffin Mohd Ihsan

Research output: Contribution to journalArticle

Abstract

The development of microelectronic industry has made solder joints failure a major reliability issue. From literature, many researchers have identified that intermetallic compounds (IMC) layer contribute greatly to the fracture of solder joint. This paper presents a finite element modeling of solder butt joints IMC layer failure based on displacement extrapolation method (DEM). Conceptual study on single edge crack of IMC solder joints is presented. A FE analytical model is proposed to be used in difference range of crack length to understand the fracture behavior of solder joint of IMC layer. The simulation results show that soldering material become less tough if greater crack length is present in the joint. It also seen that the thicker IMC has slightly reduced the stress intensity factor on the crack tip but the change from solder to IMC layer decrease the solder joint fracture toughness.

Original languageEnglish
Pages (from-to)49-57
Number of pages9
JournalLecture Notes in Mechanical Engineering
DOIs
Publication statusPublished - 2017

Fingerprint

Soldering alloys
Intermetallics
Cracks
Soldering
Extrapolation
Microelectronics
Stress intensity factors
Crack tips
Fracture toughness
Analytical models
Industry

ASJC Scopus subject areas

  • Automotive Engineering
  • Aerospace Engineering
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

Cite this

Fracture behavior of intermetallic compound (IMC) of solder joints based on finite elements’ simulation result. / Ooi, E. P.; Daud, R.; Amin, N. A.M.; Mat, F.; Sulaiman, M. H.; Abdul Majid, M. S.; Afendi, M.; Mohd Ihsan, Ahmad Kamal Ariffin.

In: Lecture Notes in Mechanical Engineering, 2017, p. 49-57.

Research output: Contribution to journalArticle

Ooi, E. P. ; Daud, R. ; Amin, N. A.M. ; Mat, F. ; Sulaiman, M. H. ; Abdul Majid, M. S. ; Afendi, M. ; Mohd Ihsan, Ahmad Kamal Ariffin. / Fracture behavior of intermetallic compound (IMC) of solder joints based on finite elements’ simulation result. In: Lecture Notes in Mechanical Engineering. 2017 ; pp. 49-57.
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