Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulation

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper presents a method to form thick spin-on glass (SOG) sacrificial layer for accelerometer encapsulation fabrication. Siloxane type SOG is applied on blank wafers and accelerometer patterns by multiple spin, bake, and cure processes. A series of gradual hot plate baking up to 250°C are experimented for each spun layer. After multiple spin and bake, the SOG layers are etched back in hydrofluoric acid (HF) solution of various concentrations to form rectangular encapsulation bases. 25 samples are prepared for SOG thickness uniformity characterization. Thickness measurements are taken for each sample using thin-film mapper. Surface profiler measurements are subsequently taken using Tencor surface profiler. Scanning electron microscope (SEM) is used to observe surface and etch wall profile after HF etching. No surface cracking was visible under SEM observation. Shallow trench patterns are apparent on SOG deposited on accelerometer pattern. The average sample thickness is 5 urn with 3.7% thickness variation across samples. The average variation within each sample is 0.14 μm with an average of 2.6% thickness variation within sample. These thickness variations are acceptable for encapsulation structure deposition.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsJ.-C. Chiao, A.S. Dzurak, C. Jagadish, D.V. Thiel
Volume6037
DOIs
Publication statusPublished - 2006
EventDevice and Process Technologies for Microelectronics, MEMS, and Photonics IV - Brisbane, Australia
Duration: 12 Dec 200514 Dec 2005

Other

OtherDevice and Process Technologies for Microelectronics, MEMS, and Photonics IV
CountryAustralia
CityBrisbane
Period12/12/0514/12/05

Fingerprint

accelerometers
Accelerometers
Encapsulation
Glass
glass
Hydrofluoric acid
Electron microscopes
hydrofluoric acid
Scanning
Thickness measurement
Surface measurement
electron microscopes
baking
Etching
scanning
siloxanes
blanks
Fabrication
Thin films
etching

Keywords

  • Accelerometer
  • Encapsulation
  • HF etch
  • Sacrificial layer
  • Spin-on glass (SOG)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Hamzah, A. A., Yeop Majlis, B., & Ahmad, I. (2006). Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulation. In J-C. Chiao, A. S. Dzurak, C. Jagadish, & D. V. Thiel (Eds.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 6037). [60370V] https://doi.org/10.1117/12.638570

Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulation. / Hamzah, Azrul Azlan; Yeop Majlis, Burhanuddin; Ahmad, Ibrahim.

Proceedings of SPIE - The International Society for Optical Engineering. ed. / J.-C. Chiao; A.S. Dzurak; C. Jagadish; D.V. Thiel. Vol. 6037 2006. 60370V.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hamzah, AA, Yeop Majlis, B & Ahmad, I 2006, Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulation. in J-C Chiao, AS Dzurak, C Jagadish & DV Thiel (eds), Proceedings of SPIE - The International Society for Optical Engineering. vol. 6037, 60370V, Device and Process Technologies for Microelectronics, MEMS, and Photonics IV, Brisbane, Australia, 12/12/05. https://doi.org/10.1117/12.638570
Hamzah AA, Yeop Majlis B, Ahmad I. Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulation. In Chiao J-C, Dzurak AS, Jagadish C, Thiel DV, editors, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6037. 2006. 60370V https://doi.org/10.1117/12.638570
Hamzah, Azrul Azlan ; Yeop Majlis, Burhanuddin ; Ahmad, Ibrahim. / Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulation. Proceedings of SPIE - The International Society for Optical Engineering. editor / J.-C. Chiao ; A.S. Dzurak ; C. Jagadish ; D.V. Thiel. Vol. 6037 2006.
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