Flow behaviour of Fluid-Structure Interaction (FSI) system of Piezoelectric Actuated Valveless Micropump (PAVM)

Juliana Johari, Burhanuddin Yeop Majlis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The flow behaviour in a valveless micropump is analyzed using the Fluid Structure Interaction (FSI) method. To accurately predict the working behavior of the micropump based on the fluid equations, structural equations and piezoelectric equations, the fluid-structure dynamic coupling effects should be taken into account. Accurate analysis of fluid-structure interaction of the micropump involves in electro mechanics, solid mechanics and fluid mechanics. Because of the complexity of the micropump, the analytic flow solution is impossible, and the full 3D numerical solution is extremely difficult. To overcome this, it is ideal to carry out 3D-FSI simulations to investigate the micropump in details.

Original languageEnglish
Title of host publicationIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
Pages216-220
Number of pages5
DOIs
Publication statusPublished - 2008
Event2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008 - Johor Bahru, Johor
Duration: 25 Nov 200827 Nov 2008

Other

Other2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008
CityJohor Bahru, Johor
Period25/11/0827/11/08

Fingerprint

Fluid structure interaction
Mechanics
Fluids
Fluid mechanics

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Johari, J., & Yeop Majlis, B. (2008). Flow behaviour of Fluid-Structure Interaction (FSI) system of Piezoelectric Actuated Valveless Micropump (PAVM). In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE (pp. 216-220). [4770311] https://doi.org/10.1109/SMELEC.2008.4770311

Flow behaviour of Fluid-Structure Interaction (FSI) system of Piezoelectric Actuated Valveless Micropump (PAVM). / Johari, Juliana; Yeop Majlis, Burhanuddin.

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. p. 216-220 4770311.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Johari, J & Yeop Majlis, B 2008, Flow behaviour of Fluid-Structure Interaction (FSI) system of Piezoelectric Actuated Valveless Micropump (PAVM). in IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE., 4770311, pp. 216-220, 2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008, Johor Bahru, Johor, 25/11/08. https://doi.org/10.1109/SMELEC.2008.4770311
Johari J, Yeop Majlis B. Flow behaviour of Fluid-Structure Interaction (FSI) system of Piezoelectric Actuated Valveless Micropump (PAVM). In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. p. 216-220. 4770311 https://doi.org/10.1109/SMELEC.2008.4770311
Johari, Juliana ; Yeop Majlis, Burhanuddin. / Flow behaviour of Fluid-Structure Interaction (FSI) system of Piezoelectric Actuated Valveless Micropump (PAVM). IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. pp. 216-220
@inproceedings{eb2eed0a8b62487bbf41e517999e0212,
title = "Flow behaviour of Fluid-Structure Interaction (FSI) system of Piezoelectric Actuated Valveless Micropump (PAVM)",
abstract = "The flow behaviour in a valveless micropump is analyzed using the Fluid Structure Interaction (FSI) method. To accurately predict the working behavior of the micropump based on the fluid equations, structural equations and piezoelectric equations, the fluid-structure dynamic coupling effects should be taken into account. Accurate analysis of fluid-structure interaction of the micropump involves in electro mechanics, solid mechanics and fluid mechanics. Because of the complexity of the micropump, the analytic flow solution is impossible, and the full 3D numerical solution is extremely difficult. To overcome this, it is ideal to carry out 3D-FSI simulations to investigate the micropump in details.",
author = "Juliana Johari and {Yeop Majlis}, Burhanuddin",
year = "2008",
doi = "10.1109/SMELEC.2008.4770311",
language = "English",
isbn = "9781424425617",
pages = "216--220",
booktitle = "IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE",

}

TY - GEN

T1 - Flow behaviour of Fluid-Structure Interaction (FSI) system of Piezoelectric Actuated Valveless Micropump (PAVM)

AU - Johari, Juliana

AU - Yeop Majlis, Burhanuddin

PY - 2008

Y1 - 2008

N2 - The flow behaviour in a valveless micropump is analyzed using the Fluid Structure Interaction (FSI) method. To accurately predict the working behavior of the micropump based on the fluid equations, structural equations and piezoelectric equations, the fluid-structure dynamic coupling effects should be taken into account. Accurate analysis of fluid-structure interaction of the micropump involves in electro mechanics, solid mechanics and fluid mechanics. Because of the complexity of the micropump, the analytic flow solution is impossible, and the full 3D numerical solution is extremely difficult. To overcome this, it is ideal to carry out 3D-FSI simulations to investigate the micropump in details.

AB - The flow behaviour in a valveless micropump is analyzed using the Fluid Structure Interaction (FSI) method. To accurately predict the working behavior of the micropump based on the fluid equations, structural equations and piezoelectric equations, the fluid-structure dynamic coupling effects should be taken into account. Accurate analysis of fluid-structure interaction of the micropump involves in electro mechanics, solid mechanics and fluid mechanics. Because of the complexity of the micropump, the analytic flow solution is impossible, and the full 3D numerical solution is extremely difficult. To overcome this, it is ideal to carry out 3D-FSI simulations to investigate the micropump in details.

UR - http://www.scopus.com/inward/record.url?scp=65949098379&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=65949098379&partnerID=8YFLogxK

U2 - 10.1109/SMELEC.2008.4770311

DO - 10.1109/SMELEC.2008.4770311

M3 - Conference contribution

AN - SCOPUS:65949098379

SN - 9781424425617

SP - 216

EP - 220

BT - IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE

ER -