Finite volume-based simulation of the wave soldering process

Influence of the conveyor angle on pin-through-hole capillary flow

M. S. Abdul Aziz, M. Z. Abdullah, C. Y. Khor, Azman Jalar @ Jalil, F. Che Ani, Nobe Yan, C. Cheok

Research output: Contribution to journalArticle

Abstract

This study aims to investigate the influence of a conveyor angle on capillary flow during the wave soldering process. Finite volume-based simulation is utilized to study the capillary flow of molten solder. Molten solder filling through capillary action of a pin-through-hole (PTH) is considered at different conveyor angles (i.e., 0-10°). Two PTH positions, namely, center (r/R = 0.2) and offset (r/R = 0.6), are investigated. The effects of a conveyor angle on molten solder filling volume, time, pressure profile, and velocity vector are numerically analyzed.

Original languageEnglish
Pages (from-to)295-310
Number of pages16
JournalNumerical Heat Transfer; Part A: Applications
Volume69
Issue number3
DOIs
Publication statusPublished - 1 Feb 2016

Fingerprint

capillary flow
Capillary flow
soldering
Soldering
solders
Finite Volume
Soldering alloys
Molten materials
Angle
Simulation
simulation
profiles
Influence

ASJC Scopus subject areas

  • Numerical Analysis
  • Condensed Matter Physics

Cite this

Finite volume-based simulation of the wave soldering process : Influence of the conveyor angle on pin-through-hole capillary flow. / Abdul Aziz, M. S.; Abdullah, M. Z.; Khor, C. Y.; Jalar @ Jalil, Azman; Che Ani, F.; Yan, Nobe; Cheok, C.

In: Numerical Heat Transfer; Part A: Applications, Vol. 69, No. 3, 01.02.2016, p. 295-310.

Research output: Contribution to journalArticle

Abdul Aziz, M. S. ; Abdullah, M. Z. ; Khor, C. Y. ; Jalar @ Jalil, Azman ; Che Ani, F. ; Yan, Nobe ; Cheok, C. / Finite volume-based simulation of the wave soldering process : Influence of the conveyor angle on pin-through-hole capillary flow. In: Numerical Heat Transfer; Part A: Applications. 2016 ; Vol. 69, No. 3. pp. 295-310.
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