FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement

Eu Poh Leng, Wong Tzu Ling, Nowshad Amin, Ibrahim Ahmad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A comparison study between Sn3.5Ag solder ball and conventional Sn3.8AgO.7Cu (SAC387) solder ball was conducted on 33×33 FCPBGA with SOP pad finishing. After assembly, samples were subjected to laser scanning for slanted ball inspection. Visual inspection under low power scope was done to check for wrinkled balls. Cold ball pull (CBP) was used to evaluate the solder joint strength at 4 conditions, namely after assembly (TO), after six time reflow, after 168 hours high temperature storage (HTS) and after Moisture Sensitivity Level 3 / 260°C test (MSL3). Cross sectioning was also performed to all condition for intermetallic compound (IMC) measurement and microstructure study. In addition, tray drop test and packing drop test were conducted to assess solder joint integrity due to handling and impact force. Solderability test was also performed to assess any possible failures during board mounting process at customers site. Finally, Sn3.5Ag is recommended to replace Sn3.8Ag0.7Cu ball for 33×33mm FCPBGA package with SOP pad finishing to resolve the wrinkled ball which is a customer concern, and to prevent slanted ball yield loss in production, as well as enhancing the overall solder joint performance with higher pull strength.

Original languageEnglish
Title of host publication10th Electronics Packaging Technology Conference, EPTC 2008
Pages1040-1045
Number of pages6
DOIs
Publication statusPublished - 2008
Event10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore
Duration: 9 Dec 200812 Dec 2008

Other

Other10th Electronics Packaging Technology Conference, EPTC 2008
CitySingapore
Period9/12/0812/12/08

Fingerprint

Soldering alloys
Inspection
Mountings
Intermetallics
Moisture
Lead-free solders
Scanning
Microstructure
Lasers
Temperature

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Leng, E. P., Ling, W. T., Amin, N., & Ahmad, I. (2008). FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement. In 10th Electronics Packaging Technology Conference, EPTC 2008 (pp. 1040-1045). [4763567] https://doi.org/10.1109/EPTC.2008.4763567

FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement. / Leng, Eu Poh; Ling, Wong Tzu; Amin, Nowshad; Ahmad, Ibrahim.

10th Electronics Packaging Technology Conference, EPTC 2008. 2008. p. 1040-1045 4763567.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Leng, EP, Ling, WT, Amin, N & Ahmad, I 2008, FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement. in 10th Electronics Packaging Technology Conference, EPTC 2008., 4763567, pp. 1040-1045, 10th Electronics Packaging Technology Conference, EPTC 2008, Singapore, 9/12/08. https://doi.org/10.1109/EPTC.2008.4763567
Leng EP, Ling WT, Amin N, Ahmad I. FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement. In 10th Electronics Packaging Technology Conference, EPTC 2008. 2008. p. 1040-1045. 4763567 https://doi.org/10.1109/EPTC.2008.4763567
Leng, Eu Poh ; Ling, Wong Tzu ; Amin, Nowshad ; Ahmad, Ibrahim. / FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement. 10th Electronics Packaging Technology Conference, EPTC 2008. 2008. pp. 1040-1045
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