Fatigue test method for observing the delamination effect in a QFN package

Shahrum Abdullah, M. F. Abdullah, A. K. Arifin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Semiconductor devices are assembled in a variety of package configurations, and are they used in various applications. The Quad Flat No Lead (QFN) package is useful for improving the reliability of the package. Generally, thermal cycle tests (TCTs) are applied to under development electronic packages in order to prove their reliability. At the early stage, however, a more effective test is desirable because of the TCTs are time-consuming. A new mechanical fatigue test for the QFN package, namely the three-point assembly fixture with a rounded contact surface test method, was proposed and it is the subject of this paper. This fixture test method is a test assembly that supports a specimen on two anvils or rollers, and symmetrically loads the specimen on the opposite surface with an anvil or roller using Micro Tester; A micro tensile tester incorporating a deflection measuring device shall be used to generate a controlled board deflection rate. The validity of the mechanical test method can then be verified based on the stress analysis results and also these obtain in the experiments. Considering the QFN package delamination, lead cracking, package body cracking, and cracking between the various lead statistically based on the experimental, it was shown that the probability during cycle loads and the maximum load for the QFN package for delamination can be estimated.

Original languageEnglish
Title of host publicationProceedings of the Electronic Packaging Technology Conference, EPTC
Pages670-674
Number of pages5
DOIs
Publication statusPublished - 2007
Event9th Electronics Packaging Technology Conference, EPTC 2007 -
Duration: 12 Dec 200712 Dec 2007

Other

Other9th Electronics Packaging Technology Conference, EPTC 2007
Period12/12/0712/12/07

Fingerprint

Delamination
Lead
Fatigue of materials
Semiconductor devices
Stress analysis
Experiments
Hot Temperature

Keywords

  • Delamination
  • Fatigue test
  • QFN package
  • Stress analysis
  • Thermal cycle

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Abdullah, S., Abdullah, M. F., & Arifin, A. K. (2007). Fatigue test method for observing the delamination effect in a QFN package. In Proceedings of the Electronic Packaging Technology Conference, EPTC (pp. 670-674). [4469711] https://doi.org/10.1109/EPTC.2007.4469711

Fatigue test method for observing the delamination effect in a QFN package. / Abdullah, Shahrum; Abdullah, M. F.; Arifin, A. K.

Proceedings of the Electronic Packaging Technology Conference, EPTC. 2007. p. 670-674 4469711.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abdullah, S, Abdullah, MF & Arifin, AK 2007, Fatigue test method for observing the delamination effect in a QFN package. in Proceedings of the Electronic Packaging Technology Conference, EPTC., 4469711, pp. 670-674, 9th Electronics Packaging Technology Conference, EPTC 2007, 12/12/07. https://doi.org/10.1109/EPTC.2007.4469711
Abdullah S, Abdullah MF, Arifin AK. Fatigue test method for observing the delamination effect in a QFN package. In Proceedings of the Electronic Packaging Technology Conference, EPTC. 2007. p. 670-674. 4469711 https://doi.org/10.1109/EPTC.2007.4469711
Abdullah, Shahrum ; Abdullah, M. F. ; Arifin, A. K. / Fatigue test method for observing the delamination effect in a QFN package. Proceedings of the Electronic Packaging Technology Conference, EPTC. 2007. pp. 670-674
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