Fabrication and characterization of surface micromachined stacked transformer on glass substrate

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17 Citations (Scopus)

Abstract

On-chip micro-transformer with square interwinding coil has been developed. The transformer consists of stacked spiral coil which is fabricated on high resistive glass substrate using MEMS technology. The device is fabricated using simple surface micromachining process including an additional bonding process for integration purpose. The performance of the micro-transformer is illustrated through low and high frequency measurements and compared with conventional Si-based micro-transformer. The results show that the RF performance of the glass-based transformer is improved compared to that of silicon-based transformer highlighting a good prospect for the future 3-dimensional RF-MEMS device application.

Original languageEnglish
Pages (from-to)2020-2025
Number of pages6
JournalMicroelectronic Engineering
Volume86
Issue number10
DOIs
Publication statusPublished - Oct 2009

Fingerprint

transformers
MEMS
Surface micromachining
Fabrication
Glass
fabrication
glass
Silicon
Substrates
microelectromechanical systems
coils
frequency measurement
micromachining
chips
low frequencies
silicon

Keywords

  • 3-dimensional RF-MEMS
  • Glass substrate
  • S-Parameter
  • Stacked transformer
  • Voltage gain

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics

Cite this

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title = "Fabrication and characterization of surface micromachined stacked transformer on glass substrate",
abstract = "On-chip micro-transformer with square interwinding coil has been developed. The transformer consists of stacked spiral coil which is fabricated on high resistive glass substrate using MEMS technology. The device is fabricated using simple surface micromachining process including an additional bonding process for integration purpose. The performance of the micro-transformer is illustrated through low and high frequency measurements and compared with conventional Si-based micro-transformer. The results show that the RF performance of the glass-based transformer is improved compared to that of silicon-based transformer highlighting a good prospect for the future 3-dimensional RF-MEMS device application.",
keywords = "3-dimensional RF-MEMS, Glass substrate, S-Parameter, Stacked transformer, Voltage gain",
author = "Jumril Yunas and Hamzah, {Azrul Azlan} and {Yeop Majlis}, Burhanuddin",
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AU - Yunas, Jumril

AU - Hamzah, Azrul Azlan

AU - Yeop Majlis, Burhanuddin

PY - 2009/10

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N2 - On-chip micro-transformer with square interwinding coil has been developed. The transformer consists of stacked spiral coil which is fabricated on high resistive glass substrate using MEMS technology. The device is fabricated using simple surface micromachining process including an additional bonding process for integration purpose. The performance of the micro-transformer is illustrated through low and high frequency measurements and compared with conventional Si-based micro-transformer. The results show that the RF performance of the glass-based transformer is improved compared to that of silicon-based transformer highlighting a good prospect for the future 3-dimensional RF-MEMS device application.

AB - On-chip micro-transformer with square interwinding coil has been developed. The transformer consists of stacked spiral coil which is fabricated on high resistive glass substrate using MEMS technology. The device is fabricated using simple surface micromachining process including an additional bonding process for integration purpose. The performance of the micro-transformer is illustrated through low and high frequency measurements and compared with conventional Si-based micro-transformer. The results show that the RF performance of the glass-based transformer is improved compared to that of silicon-based transformer highlighting a good prospect for the future 3-dimensional RF-MEMS device application.

KW - 3-dimensional RF-MEMS

KW - Glass substrate

KW - S-Parameter

KW - Stacked transformer

KW - Voltage gain

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