Evaluation of different die attach film and epoxy pastes for stacked die QFN package

Ibrahim Ahmad, Nur Nadia Bachok, Ng Cheong Chiang, Meor Zainal Meor Talib, Mohamad Firdaus Rosle, Farah Liyana Ab Latip, Zurlinda Asma Aziz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

The trend in the semiconductor industry is to develop more powerful components while decreasing the component size. A suitable material set has to be obtained for the required reliability performance. The objective of this study is to evaluate the performance of different die attach film (DAF) and epoxy pastes for stacked die Quad Flat No-lead package. Both experimental and modeling works are resorted to analyze and refine the package design. Six combinations of die attach materials are evaluated to compare with current single die package. The strengths and weaknesses of the DAF and epoxy paste are compared in this paper. Die shear test is performed to study the adhesion condition between the die attach material and silicon die. Finite element model of the package is generated to determine the thermally induced stresses under different conditions. All the results show that it is robust to use the new epoxy paste and DAF.

Original languageEnglish
Title of host publicationProceedings of the Electronic Packaging Technology Conference, EPTC
Pages869-873
Number of pages5
DOIs
Publication statusPublished - 2007
Event9th Electronics Packaging Technology Conference, EPTC 2007 -
Duration: 12 Dec 200712 Dec 2007

Other

Other9th Electronics Packaging Technology Conference, EPTC 2007
Period12/12/0712/12/07

Fingerprint

Adhesion
Lead
Semiconductor materials
Silicon
Industry

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Ahmad, I., Bachok, N. N., Chiang, N. C., Meor Talib, M. Z., Rosle, M. F., Latip, F. L. A., & Aziz, Z. A. (2007). Evaluation of different die attach film and epoxy pastes for stacked die QFN package. In Proceedings of the Electronic Packaging Technology Conference, EPTC (pp. 869-873). [4469691] https://doi.org/10.1109/EPTC.2007.4469691

Evaluation of different die attach film and epoxy pastes for stacked die QFN package. / Ahmad, Ibrahim; Bachok, Nur Nadia; Chiang, Ng Cheong; Meor Talib, Meor Zainal; Rosle, Mohamad Firdaus; Latip, Farah Liyana Ab; Aziz, Zurlinda Asma.

Proceedings of the Electronic Packaging Technology Conference, EPTC. 2007. p. 869-873 4469691.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ahmad, I, Bachok, NN, Chiang, NC, Meor Talib, MZ, Rosle, MF, Latip, FLA & Aziz, ZA 2007, Evaluation of different die attach film and epoxy pastes for stacked die QFN package. in Proceedings of the Electronic Packaging Technology Conference, EPTC., 4469691, pp. 869-873, 9th Electronics Packaging Technology Conference, EPTC 2007, 12/12/07. https://doi.org/10.1109/EPTC.2007.4469691
Ahmad I, Bachok NN, Chiang NC, Meor Talib MZ, Rosle MF, Latip FLA et al. Evaluation of different die attach film and epoxy pastes for stacked die QFN package. In Proceedings of the Electronic Packaging Technology Conference, EPTC. 2007. p. 869-873. 4469691 https://doi.org/10.1109/EPTC.2007.4469691
Ahmad, Ibrahim ; Bachok, Nur Nadia ; Chiang, Ng Cheong ; Meor Talib, Meor Zainal ; Rosle, Mohamad Firdaus ; Latip, Farah Liyana Ab ; Aziz, Zurlinda Asma. / Evaluation of different die attach film and epoxy pastes for stacked die QFN package. Proceedings of the Electronic Packaging Technology Conference, EPTC. 2007. pp. 869-873
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