Evaluation of contiguous and non-contiguous channel bonding schemes based on TVWS spectrum occupancy in Malaysia

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Contiguous and Non-Contiguous Channel Bonding (CnNCCB) have been considered in TV White Space (TVWS) standard, (i.e. IEEE 802.11af) to combine more than one channel in TVWS band. To support more flexible channel bandwidth of TVWS, this paper investigates different types of CnNCCB, namely Dynamic Channel Bonding (DCB), Uniform Channel Bonding (UCB) and Standard Channel Bonding (SCB). Measurement has been conducted to investigate the availability of TVWS at eight different sub-urban/urban locations in Malaysia. We also examine and compare the measurement data with the random best fit normal data. The results show that four locations (ALS, KKB, KTR and SMR) did better CnNCCB than others, while Uniform Channel Bonding (UCB) achieved the highest number of channel bonding compared to SCB and DCB. The findings in this paper provide insight into the actual TV band spectrum occupancy and the best channel bonding criteria based on the TV channel occupancy in Malaysia.

Original languageEnglish
Title of host publication2015 IEEE 12th Malaysia International Conference on Communications, MICC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages53-58
Number of pages6
ISBN (Electronic)9781509000197
DOIs
Publication statusPublished - 27 Oct 2016
Event12th IEEE Malaysia International Conference on Communications, MICC 2015 - Kuching, Sarawak, Malaysia
Duration: 23 Nov 201525 Nov 2015

Other

Other12th IEEE Malaysia International Conference on Communications, MICC 2015
CountryMalaysia
CityKuching, Sarawak
Period23/11/1525/11/15

Fingerprint

Malaysia
evaluation
Advanced Launch System (STS)
availability
Availability

Keywords

  • Cognitive Radio
  • Contiguous and Non-Contiguous Channel Bonding
  • Dynamic Channel Bonding
  • Standard Channel Bonding
  • TV Band
  • TV White Space
  • Uniform Channel Bonding

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Signal Processing
  • Instrumentation

Cite this

Rahim, R. A., Nordin, R., Ismail, M., & Abdullah, N. F. (2016). Evaluation of contiguous and non-contiguous channel bonding schemes based on TVWS spectrum occupancy in Malaysia. In 2015 IEEE 12th Malaysia International Conference on Communications, MICC 2015 (pp. 53-58). [7725406] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MICC.2015.7725406

Evaluation of contiguous and non-contiguous channel bonding schemes based on TVWS spectrum occupancy in Malaysia. / Rahim, Razimah Abdul; Nordin, Rosdiadee; Ismail, Mahamod; Abdullah, Nor Fadzilah.

2015 IEEE 12th Malaysia International Conference on Communications, MICC 2015. Institute of Electrical and Electronics Engineers Inc., 2016. p. 53-58 7725406.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rahim, RA, Nordin, R, Ismail, M & Abdullah, NF 2016, Evaluation of contiguous and non-contiguous channel bonding schemes based on TVWS spectrum occupancy in Malaysia. in 2015 IEEE 12th Malaysia International Conference on Communications, MICC 2015., 7725406, Institute of Electrical and Electronics Engineers Inc., pp. 53-58, 12th IEEE Malaysia International Conference on Communications, MICC 2015, Kuching, Sarawak, Malaysia, 23/11/15. https://doi.org/10.1109/MICC.2015.7725406
Rahim RA, Nordin R, Ismail M, Abdullah NF. Evaluation of contiguous and non-contiguous channel bonding schemes based on TVWS spectrum occupancy in Malaysia. In 2015 IEEE 12th Malaysia International Conference on Communications, MICC 2015. Institute of Electrical and Electronics Engineers Inc. 2016. p. 53-58. 7725406 https://doi.org/10.1109/MICC.2015.7725406
Rahim, Razimah Abdul ; Nordin, Rosdiadee ; Ismail, Mahamod ; Abdullah, Nor Fadzilah. / Evaluation of contiguous and non-contiguous channel bonding schemes based on TVWS spectrum occupancy in Malaysia. 2015 IEEE 12th Malaysia International Conference on Communications, MICC 2015. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 53-58
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