Estimation of thin film stress in buckled MEMS bridge from pull-in voltage

Latif Rhonira, Muhammad Fahmi Bin Jaafar, Burhanuddin Yeop Majlis, Muhtade Mustafa Aqil

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A simple and easy method to estimate either compressive or tensile thin film stress that exists within the buckled MEMS bridge structure is presented. An array of tantalum MEMS bridge with buckle profile is fabricated at length 570 μm-1620 μm. The distance between the maximum vertical deflection of the fabricated buckled tantalum bridge to the substrate is measured. The analytical pull-in voltage for buckled tantalum bridge at different length is calculated, taking into account the influence of strain and bridge's curvature profile. The pull-in voltage of the fabricated buckled tantalum MEMS bridge is measured and compared to the analytical model. The stress is then estimated by fitting the experimental measurement results to the analytical model using the least mean square method. The presence of stress within the buckled tantalum MEMS bridge structures has been found to be compressive. The average tantalum thin film stress value has been estimated to be ∼0.24 MPa.

Original languageEnglish
Title of host publicationProceedings of the 2017 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-4
Number of pages4
ISBN (Electronic)9781509040285
DOIs
Publication statusPublished - 16 Oct 2017
Event11th IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2017 - Batu Ferringhi, Penang, Malaysia
Duration: 23 Aug 201725 Aug 2017

Other

Other11th IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2017
CountryMalaysia
CityBatu Ferringhi, Penang
Period23/8/1725/8/17

Fingerprint

tantalum
Tantalum
microelectromechanical systems
MEMS
Thin films
Electric potential
electric potential
thin films
bridges (structures)
Analytical models
profiles
deflection
curvature
estimates
Substrates

Keywords

  • buckling
  • MEMS bridge
  • pull-in voltage
  • residual stress

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation
  • Biomedical Engineering

Cite this

Rhonira, L., Bin Jaafar, M. F., Yeop Majlis, B., & Aqil, M. M. (2017). Estimation of thin film stress in buckled MEMS bridge from pull-in voltage. In Proceedings of the 2017 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2017 (pp. 1-4). [8069121] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/RSM.2017.8069121

Estimation of thin film stress in buckled MEMS bridge from pull-in voltage. / Rhonira, Latif; Bin Jaafar, Muhammad Fahmi; Yeop Majlis, Burhanuddin; Aqil, Muhtade Mustafa.

Proceedings of the 2017 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-4 8069121.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rhonira, L, Bin Jaafar, MF, Yeop Majlis, B & Aqil, MM 2017, Estimation of thin film stress in buckled MEMS bridge from pull-in voltage. in Proceedings of the 2017 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2017., 8069121, Institute of Electrical and Electronics Engineers Inc., pp. 1-4, 11th IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2017, Batu Ferringhi, Penang, Malaysia, 23/8/17. https://doi.org/10.1109/RSM.2017.8069121
Rhonira L, Bin Jaafar MF, Yeop Majlis B, Aqil MM. Estimation of thin film stress in buckled MEMS bridge from pull-in voltage. In Proceedings of the 2017 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1-4. 8069121 https://doi.org/10.1109/RSM.2017.8069121
Rhonira, Latif ; Bin Jaafar, Muhammad Fahmi ; Yeop Majlis, Burhanuddin ; Aqil, Muhtade Mustafa. / Estimation of thin film stress in buckled MEMS bridge from pull-in voltage. Proceedings of the 2017 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1-4
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